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参数资料
| 型号： | M52259EVB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 28/46页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR 52259 COLDFIRE V2 |
| 产品培训模块： | ColdFire MCF5225x |
| 标准包装： | 1 |
| 系列： | ColdFire® |
| 类型： | MCU |
| 适用于相关产品： | MCF52259 |
| 所含物品： | 板，线缆，文档，DVD，闪光灯驱动和电源 |
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Electrical Characteristics
16
17
18
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
The average chip-junction temperature (T J ) in ? C can be obtained from:
T J = T A + ? P D ? ? JMA ? (1)
Where:
T A
? JA
P D
P INT
P I/O
= ambient temperature, ? C
= package thermal resistance, junction-to-ambient, ? C/W
= P INT ?? P I/O
= chip internal power, I DD ? V DD , W
= power dissipation on input and output pins — user determined, W
For most applications P I/O ? P INT and can be ignored. An approximate relationship between P D and T J (if P I/O is neglected) is:
P D = K ? ? T J + 273 ? C ?
(2)
Solving equations 1 and 2 for K gives:
K = P D ? (T A + 273 ? C) + ? JMA ? P D 2 (3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring P D (at equilibrium)
for a known T A . Using this value of K, the values of P D and T J can be obtained by solving equations (1) and (2) iteratively for
any value of T A .
2.4
Flash Memory Characteristics
Table 9. SGFM Flash Program and Erase Characteristics
(V DD = 3.0 to 3.6 V)
Parameter
System clock (read only)
Symbol
f sys(R)
Min
0
Typ
—
Max
66.67 or 80 1
Unit
MHz
System clock (program/erase)
2
f sys(P/E)
0.15
—
66.67 or
80 1
MHz
1
2
Depending on packaging; see the orderable part number summary ( Table 2 ).
Refer to the flash memory section for more information ( Section 2.4, “Flash Memory Characteristics ”)
Table 10. SGFM Flash Module Life Characteristics
(V DD = 3.0 to 3.6 V)
Parameter
Maximum number of guaranteed program/erase cycles 1 before failure
Data retention at average operating temperature of 85 ? C
A program/erase cycle is defined as switching the bits from 1 ? 0 ? 1.
1
Symbol
P/E
Retention
Value
10,000 2
10
Unit
Cycles
Years
MCF52259 ColdFire Microcontroller, Rev. 5
Freescale
28
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相关代理商/技术参数 |
参数描述 |
|---|---|
| M52259EVB | 制造商:Freescale Semiconductor 功能描述:MCF5225x Evaluation Board |
| M5226P | 制造商:Panasonic Industrial Company 功能描述:IC |
| M5226PFP | 制造商:MITSUBISHI 制造商全称:Mitsubishi Electric Semiconductor 功能描述:5-ELEMENT GRAPHIC EQUALIZER IC |
| M52277EVB | 功能描述:开发板和工具包 - 其他处理器 EVAL BOARD FOR THE M52277x RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| M5228FP | 制造商:Panasonic Industrial Company 功能描述:IC |
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