参数资料
型号: MAX15035ETL+T
厂商: Maxim Integrated Products
文件页数: 25/27页
文件大小: 0K
描述: IC REG BOOST SYNC 15A 40TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: 升压(升压)
输出类型: 固定
输出数: 1
输出电压: 1.05V,1.5V
输入电压: 4.5 V ~ 26 V
PWM 型: 电流模式
电流 - 输出: 15A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 40-WFQFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 40-TQFN-EP(6x6)
15A Step-Down Regulator with Internal Switches
V IN ( MIN ) = ?
? = 3 . 74 V
V IN ( MIN ) = ?
? = 3 . 52 V
? 3 . 3 V ? 0 V + 150 mV ?
? 1 ? ( 1 . 5 × 350 ns × 300 kHz ) ?
Calculating again with h = 1 gives the absolute limit of
dropout:
? 3 . 3 V ? 0 V + 150 mV ?
? 1 ? ( 1 . 0 × 350 ns × 300 kHz ) ?
Therefore, V IN must be greater than 3.52V, even with
very large output capacitance, and a practical input volt-
age with reasonable output capacitance would be 3.74V.
Applications Information
PCB Layout Guidelines
Careful PCB layout is critical to achieve low switching
losses and clean, stable operation. The switching
power stage requires particular attention. If possible,
mount all the power components on the top side of the
board with their ground terminals flush against one
another. Follow these guidelines for good PCB layout:
1) Keep the high-current paths short, especially at the
ground terminals. This is essential for stable, jitter-
free operation.
2) Connect all analog grounds to a separate solid
copper plane, which connects to the AGND pin of
the Quick-PWM controller. This includes the V CC
bypass capacitor, REF bypass capacitors, REFIN
components, and feedback compensation/dividers.
3) Keep the power traces and load connections short.
This is essential for high efficiency. The use of thick
copper PCB (2oz vs. 1oz) can enhance full-load
efficiency by 1% or more. Correctly routing PCB
traces is a difficult task that must be approached in
terms of fractions of centimeters, where a single
milliohms of excess trace resistance causes a mea-
surable efficiency penalty.
4) Keep the power plane—especially LX—away from
sensitive analog areas (REF, REFIN, FB, ILIM).
Layout Procedure
1) Place the power components first, with ground ter-
minals adjacent (C IN and C OUT ). If possible, make
all these connections on the top layer with wide,
copper-filled areas.
2) Make the DC-DC controller ground connections as
shown in Figure 1. This diagram can be viewed as
having four separate ground planes: input/output
ground, where all the high-power components go;
the power ground plane, where the PGND pin and
V DD bypass capacitor go; the controller’s analog
ground plane where sensitive analog components,
the controller’s AGND pin, and V CC bypass capaci-
tor go. The controller’s AGND plane must meet the
PGND plane only at a single point directly beneath
the IC. This point must also be very close to the out-
put capacitor ground terminal.
3) Connect the output power planes (V CORE and sys-
tem ground planes) directly to the output filter
capacitor positive and negative terminals with multi-
ple vias. Place the entire DC-DC converter circuit
as close to the load as is practical.
______________________________________________________________________________________
25
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