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参数资料
| 型号： | MAX19711ETN+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 25/36页 |
| 文件大小： | 0K |
| 描述： | IC ANLG FRONT END 11MSPS 56-TQFN |
| 产品变化通告： | Product Discontinuation 09/Jun/2011 |
| 标准包装： | 43 |
| 位数： | 10 |
| 通道数： | 2 |
| 功率（瓦特）： | 37.5mW |
| 电压 - 电源，模拟： | 3V |
| 电压 - 电源，数字： | 3V |
| 封装/外壳： | 56-WFQFN 裸露焊盘 |
| 供应商设备封装： | 56-TQFN-EP（7x7） |
| 包装： | 管件 |
| 产品目录页面： | 1398 (CN2011-ZH PDF) |
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MAX19711
10-Bit, 11Msps, Full-Duplex
Analog Front-End
______________________________________________________________________________________
31
70k
Ω. If single-ended outputs are desired, use an
amplifier to provide differential-to-single-ended conver-
sion and select an amplifier with proper input common-
mode voltage range.
CDMA Application
Figure 14 illustrates a typical CDMA application circuit.
The MAX19711 is designed to interface directly with the
MAX2504 and MAX2584 radio front-ends to provide
a complete “RF-to-Bits” front-end solution. The
MAX19711 provides several features that allow direct
interface to the MAX2584 and MAX2504:
Integrated Tx filters reduce component count, lower
cost, and meet CDMA spectral mask requirements
Programmable DC common-mode Tx output levels
eliminate discrete DC-level-shifting components
while preserving Tx DAC full dynamic range
Optimized Tx full-scale output level eliminates dis-
crete amplifiers for ID–QD gain control
Tx-ID–QD offset correction eliminates discrete trim
DACs for offset trim to improve sideband/carrier
suppression
1s settling time aux-DACs for VGA and AGC control
allow fast, accurate Tx power and Rx gain control
Grounding, Bypassing, and
Board Layout
The MAX19711 requires high-speed board layout design
techniques. Refer to the MAX19711 EV kit data sheet for a
board layout reference. Place all bypass capacitors as
close to the device as possible, preferably on the same
side of the board as the device, using surface-mount
devices for minimum inductance. Bypass VDD to GND
with a 0.1F ceramic capacitor in parallel with a 2.2F
capacitor. Bypass OVDD to OGND with a 0.1F ceramic
capacitor in parallel with a 2.2F capacitor. Bypass REFP,
REFN, and COM each to GND with a 0.33F ceramic
capacitor. Bypass REFIN to GND with a 0.1F capacitor.
Multilayer boards with separated ground and power
planes yield the highest level of signal integrity. Use a
split ground plane arranged to match the physical loca-
tion of the analog ground (GND) and the digital output-
driver ground (OGND) on the device package. Connect
the MAX19711 exposed backside paddle to the GND
plane. Join the two ground planes at a single point so
the noisy digital ground currents do not interfere with
the analog ground plane. The ideal location for this
connection can be determined experimentally at a
point along the gap between the two ground planes.
Make this connection with a low-value, surface-mount
resistor (1
Ω to 5Ω), a ferrite bead, or a direct short.
Figure 13. Rx ADC DC-Coupled Differential Drive
MAX19711
IAP
COM
IAN
RISO
22
Ω
RISO
22
Ω
R11
600
Ω
R9
600
Ω
R3
600
Ω
R2
600
Ω
R1
600
Ω
R10
600
Ω
R8
600
Ω
R5
600
Ω
R4
600
Ω
R7
600
Ω
R6
600
Ω
CIN
5pF
CIN
5pF
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX19711ETN+ | 功能描述:ADC / DAC多通道 11Msps CODEC/AFE Full Duplex RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX19711ETN+T | 功能描述:ADC / DAC多通道 11Msps CODEC/AFE Full Duplex RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX19711ETN-T | 功能描述:ADC / DAC多通道 RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX19711EVCMODU+ | 功能描述:数据转换 IC 开发工具 MAX19710/13 Eval Kit RoHS:否 制造商:Texas Instruments 产品:Demonstration Kits 类型:ADC 工具用于评估:ADS130E08 接口类型:SPI 工作电源电压:- 6 V to + 6 V |
| MAX19711EVKIT | 功能描述:数据转换 IC 开发工具 RoHS:否 制造商:Texas Instruments 产品:Demonstration Kits 类型:ADC 工具用于评估:ADS130E08 接口类型:SPI 工作电源电压:- 6 V to + 6 V |
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