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参数资料
| 型号： | MC56F8002VWL |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 75/106页 |
| 文件大小： | 0K |
| 描述： | DSC 12K FLASH 32MHZ 28-SOIC |
| 标准包装： | 26 |
| 系列： | 56F8xxx |
| 核心处理器： | 56800E |
| 芯体尺寸： | 16-位 |
| 速度： | 32MHz |
| 连通性： | I²C，LIN，SCI，SPI |
| 外围设备： | LVD，POR，PWM，WDT |
| 输入/输出数： | 23 |
| 程序存储器容量： | 12KB（6K x 16） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 1K x 16 |
| 电压 - 电源 (Vcc/Vdd)： | 1.8 V ~ 3.6 V |
| 数据转换器： | A/D 15x12b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 105°C |
| 封装/外壳： | 28-SOIC（0.295"，7.50mm 宽） |
| 包装： | 管件 |
| 产品目录页面： | 734 (CN2011-ZH PDF) |
| 配用： | APMOTOR56F8000E-ND - KIT DEMO MOTOR CTRL SYSTEM |
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MC56F8006/MC56F8002 Digital Signal Controller, Rev. 4
Design Considerations
Freescale Semiconductor
70
9
Design Considerations
9.1
Thermal Design Considerations
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RJ x PD)
Eqn. 3
where:
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy estimation of thermal
performance. Unfortunately, there are two values in common usage: the value determined on a single-layer board and the value
obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which
value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a
single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low-power dissipation and the components are well separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal resistance and a
case-to-ambient thermal resistance:
RJA = RJC + RCA
Eqn. 4
where:
RJC is device related and cannot be adjusted. You control the thermal environment to change the case to ambient thermal
resistance, RCA. For instance, you can change the size of the heat sink, the air flow around the device, the interface material,
the mounting arrangement on printed circuit board, or change the thermal dissipation on the printed circuit board surrounding
the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the thermal characterization
parameter (
JT) can be used to determine the junction temperature with a measurement of the temperature at the top center of
the package case using the following equation:
TJ = TT + (JT x PD)
Eqn. 5
where:
The thermal characterization parameter is measured per JESD51–2 specification using a 40-gauge type T thermocouple epoxied
to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the
TA
=
Ambient temperature for the package (oC)
RJ
=
Junction-to-ambient thermal resistance (oC/W)
PD
=
Power dissipation in the package (W)
RJA
=
Package junction-to-ambient thermal resistance (°C/W)
RJC
=
Package junction-to-case thermal resistance (°C/W)
RCA
=
Package case-to-ambient thermal resistance (°C/W)
TT
=
Thermocouple temperature on top of package (oC)
JT
=
Thermal characterization parameter (oC/W)
PD
=
Power dissipation in package (W)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC56F8002VWL | 制造商:Freescale Semiconductor 功能描述:IC DSC 16BIT 12KB 32MHZ 3.6V SOIC-28 |
| MC56F8006 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Digital Signal Controller |
| MC56F8006DEMO | 功能描述:开发板和工具包 - 其他处理器 MC56F8006 DEMO BOARD RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MC56F8006DEMO | 制造商:Freescale Semiconductor 功能描述:MC56F8006DEMO board w/o USB TAP |
| MC56F8006DEMO-T | 功能描述:开发板和工具包 - 其他处理器 MC56F8006 DEMO BOARD RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
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