参数资料
型号: MC56F8033VLC
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, PQFP32
封装: ROHS COMPLIANT, PLASTIC, LQFP-32
文件页数: 22/157页
文件大小: 2117K
代理商: MC56F8033VLC
56F8033/56F8023 Data Sheet, Rev. 6
118
Freescale Semiconductor
1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p
thermal test board.
2. Junction to ambient thermal resistance, Theta-JA (RθJA), was simulated to be equivalent to the JEDEC specification JESD51-2
in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes
(2s2p, where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name
for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.
3. Junction to case thermal resistance, Theta-JC (RθJC), was simulated to be equivalent to the measured values using the cold plate
technique with the cold plate temperature used as the “case” temperature. The basic cold plate measurement technique is de-
scribed by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the
package is being used with a heat sink.
4. Junction to board thermal resistance, Theta-JB (RθJB), is a metric of the thermal resistance from the junction to the printed circuit
board determined per JESD51-8. Board temperature is measured on the top surface of the board near the package.
5. Thermal Characterization Parameter, Psi-JT (YJT), is the “resistance” from junction to reference point thermocouple on top center
of case as defined in JESD51-2. YJT is a useful value to use to estimate junction temperature in steady state customer
environments.
6. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
7. See Section 12.1 for more details on thermal design considerations.
ESD for Machine Model (MM)
200
V
ESD for Charge Device Model (CDM)
750
V
Table 10-3 LQFP Package Thermal Characteristics6
Characteristic
Comments
Symbol
Value
(LQFP)
Unit
Notes
Junction to ambient
Natural convection
Single layer board
(1s)
RθJA
41
°C/W
2
Junction to ambient
Natural convection
Four layer board
(2s2p)
RθJMA
34
°C/W
1, 2
Junction to ambient
(@200 ft/min)
Single layer board
(1s)
RθJMA
34
°C/W
2
Junction to ambient
(@200 ft/min)
Four layer board
(2s2p)
RθJMA
29
°C/W
1, 2
Junction to board
RθJB
24
°C/W
4
Junction to case
RθJC
8°C/W
3
Junction to package top
Natural Convection
ΨJT
2°C/W
5
Table 10-2 56F8033/56F8023 ESD Protection
Characteristic
Min
Typ
Max
Unit
相关PDF资料
PDF描述
MC56F8347MPY60 16-BIT, 120 MHz, OTHER DSP, PQFP160
MC56F8355VFG60 4-BIT, 120 MHz, OTHER DSP, PQFP128
MC56F8355MFG60 4-BIT, 120 MHz, OTHER DSP, PQFP128
MC6805R2CP 8-BIT, MROM, MICROCONTROLLER, PDIP40
MC68302PV25C LOCAL AREA NETWORK CONTROLLER, PQFP144
相关代理商/技术参数
参数描述
MC56F8035VLD 功能描述:数字信号处理器和控制器 - DSP, DSC 16 BIT DSPHC 64KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MC56F8035VLDR 功能描述:数字信号处理器和控制器 - DSP, DSC 16 BIT DSPHC 64KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MC56F8036 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers
MC56F8036VLF 功能描述:数字信号处理器和控制器 - DSP, DSC 16 BIT DSPHC RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MC56F8036VLF 制造商:Freescale Semiconductor 功能描述:IC DSC 64KB 32MHZ 3.6V LQFP-48