参数资料
型号: MC56F8356MFVE
厂商: Freescale Semiconductor
文件页数: 85/178页
文件大小: 0K
描述: IC DSP 16BIT 60MHZ 144-LQFP
标准包装: 60
系列: 56F8xxx
核心处理器: 56800E
芯体尺寸: 16-位
速度: 60MHz
连通性: CAN,EBI/EMI,SCI,SPI
外围设备: POR,PWM,温度传感器,WDT
输入/输出数: 62
程序存储器容量: 264KB(132K x 16)
程序存储器类型: 闪存
RAM 容量: 10K x 16
电压 - 电源 (Vcc/Vdd): 2.25 V ~ 3.6 V
数据转换器: A/D 16x12b
振荡器型: 外部
工作温度: -40°C ~ 125°C
封装/外壳: 144-LQFP
包装: 托盘
配用: MC56F8367EVME-ND - EVAL BOARD FOR MC56F83X
Electrical Design Considerations
56F8356 Technical Data, Rev. 13
Freescale Semiconductor
175
Preliminary
where:
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back-calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction-to-case
thermal resistance.
12.2 Electrical Design Considerations
Use the following list of considerations to assure correct device operation:
Provide a low-impedance path from the board power supply to each VDD pin on the device, and from the
board ground to each VSS (GND) pin
The minimum bypass requirement is to place six 0.01–0.1
μF capacitors positioned as close as possible to
the package supply pins. The recommended bypass configuration is to place one bypass capacitor on each
of the VDD/VSS pairs, including VDDA/VSSA. Ceramic and tantalum capacitors tend to provide better
performance tolerances.
TT
=
Thermocouple temperature on top of package (oC)
Ψ
JT
=
Thermal characterization parameter (oC)/W
PD
=
Power dissipation in package (W)
CAUTION
This device contains protective circuitry to guard
against damage due to high static voltage or electrical
fields. However, normal precautions are advised to
avoid
application
of
any
voltages
higher
than
maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are
tied to an appropriate voltage level.
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