参数资料
型号: MC56F8356VFVE
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 数字信号处理
英文描述: 16-BIT, 120 MHz, OTHER DSP, PQFP144
封装: ROHS COMPLIANT, LQFP-144
文件页数: 84/178页
文件大小: 910K
代理商: MC56F8356VFVE
56F8356 Technical Data, Rev. 13
174
Freescale Semiconductor
Preliminary
Please see www.freescale.com for the most current case outline.
Part 12 Design Considerations
12.1 Thermal Design Considerations
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJΑ x PD)
where:
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, there are two values in common usage: the value
determined on a single-layer board and the value obtained on a board with two planes. For packages such
as the PBGA, these values can be different by a factor of two. Which value is closer to the application
depends on the power dissipated by other components on the board. The value obtained on a single-layer
board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the
internal planes is usually appropriate if the board has low-power dissipation and the components are well
separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJΑ = RθJC + RθCΑ
where:
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA . For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the
Thermal Characterization Parameter (
Ψ
JT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT x PD)
TA
= Ambient temperature for the package (oC)
RθJΑ = Junction-to-ambient thermal resistance (
oC/W)
PD
= Power dissipation in the package (W)
RθJA
= Package junction-to-ambient thermal resistance °C/W
RθJC
= Package junction-to-case thermal resistance °C/W
RθCA = Package case-to-ambient thermal resistance °C/W
相关PDF资料
PDF描述
MPC8272VRPIEX 32-BIT, 300 MHz, RISC PROCESSOR, PBGA516
MC9S12HA64VLLR 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, PQFP100
MC908QB8MDTE 8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PDSO16
MC56F8122VFAE 0-BIT, 80 MHz, OTHER DSP, PQFP48
MC908GR32AMFJR2 8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PQFP32
相关代理商/技术参数
参数描述
MC56F8357 制造商:未知厂家 制造商全称:未知厂家 功能描述:16-BIT HYBRID CONTROLLERS
MC56F8357EVM 功能描述:KIT EVALUATION FOR MC56F8357 RoHS:否 类别:编程器,开发系统 >> 过时/停产零件编号 系列:- 标准包装:1 系列:- 传感器类型:CMOS 成像,彩色(RGB) 传感范围:WVGA 接口:I²C 灵敏度:60 fps 电源电压:5.7 V ~ 6.3 V 嵌入式:否 已供物品:成像器板 已用 IC / 零件:KAC-00401 相关产品:4H2099-ND - SENSOR IMAGE WVGA COLOR 48-PQFP4H2094-ND - SENSOR IMAGE WVGA MONO 48-PQFP
MC56F8357MPY60 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:16-bit Digital Signal Processor
MC56F8357MPYE 功能描述:数字信号处理器和控制器 - DSP, DSC 16 BIT HYBRID CONTROLLER RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MC56F8357VPY60 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:16-bit Digital Signal Processor