参数资料
型号: MC68HC705C9ACP
厂商: Freescale Semiconductor
文件页数: 112/118页
文件大小: 0K
描述: IC MCU 2.1MHZ 16K OTP 40-DIP
标准包装: 9
系列: HC05
核心处理器: HC05
芯体尺寸: 8-位
速度: 2.1MHz
连通性: SCI,SPI
外围设备: POR,WDT
输入/输出数: 24
程序存储器容量: 16KB(16K x 8)
程序存储器类型: OTP
RAM 容量: 352 x 8
电压 - 电源 (Vcc/Vdd): 3 V ~ 5.5 V
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 40-DIP(0.600",15.24mm)
包装: 管件
MC68HC05C9A Advance Information Data Sheet, Rev. 4.1
Freescale Semiconductor
93
Chapter 12
Electrical Specifications
12.1 Maximum Ratings
Maximum ratings are the extreme limits to which the MCU can be exposed without permanently damaging
it.
The MCU contains circuitry to protect the inputs against damage from high static voltages; however, do
not apply voltages higher than those shown in the table below. Keep VIn and VOut within the range
VSS ≤ (VIn or VOut) ≤ VDD. Connect unused inputs to the appropriate voltage level, either VSS or VDD.
NOTE
This device is not guaranteed to operate properly at the maximum ratings.
Refer to 12.5 5.0-Vdc Electrical Characteristics for guaranteed operating
conditions.
12.2 Operating Temperature
12.3 Thermal Characteristics
Rating
Symbol
Value
Unit
Supply voltage
VDD
–0.3 to +7.0
V
Input voltage
Normal operation
Bootloader mode (IRQ pin only)
VIn
VSS –0.3 to VDD + 0.3
VSS –0.3 to 2 x VDD + 0.3
V
Current drain per pin (Excluding VDD and VSS)
I25
mA
Storage temperature range
TSTG
–65 to +150
°C
Characteristic
Symbol
Value
Unit
Operating temperature range
TA
–40 to +85
°C
Characteristic
Symbol
Value
Unit
Thermal resistance plastic dual in-line (PDIP)
θJA
60
°C/W
Thermal resistance plastic leaded chip carrier (PLCC)
θJA
70
°C/W
Thermal resistance quad flat pack (QFP)
θJA
95
°C/W
Thermal resistance plastic shrink DIP (SDIP)
θJA
60
°C/W
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