参数资料
型号: MC68HC705P6ACP
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP28
封装: PLASTIC, DIP-28
文件页数: 7/98页
文件大小: 532K
代理商: MC68HC705P6ACP
Functional Pin Description
MC68HC705P6A Advance Information Data Sheet, Rev. 2.1
Freescale Semiconductor
15
1.3 Functional Pin Description
The following paragraphs describe the functionality of each pin on the MC68HC705P6A package. Pins
connected to subsystems described in other chapters provide a reference to the chapter instead of a
detailed functional description.
1.3.1 V
DD and VSS
Power is supplied to the MCU through VDD and VSS. VDD is connected to a regulated +5 volt supply and
VSS is connected to ground.
Very fast signal transitions occur on the MCU pins. The short rise and fall times place very high
short-duration current demands on the power supply. To prevent noise problems, take special care to
provide good power supply bypassing at the MCU. Use bypass capacitors with good high-frequency
characteristics and position them as close to the MCU as possible. Bypassing requirements vary,
depending on how heavily the MCU pins are loaded.
1.3.2 OSC1 and OSC2
The OSC1 and OSC2 pins are the control connections for the on-chip oscillator. The OSC1 and OSC2
pins can accept the following:
1.
A crystal as shown in Figure 1-2(a)
2.
A ceramic resonator as shown in Figure 1-2(a)
3.
An external clock signal as shown in Figure 1-2(b)
The frequency, fosc, of the oscillator or external clock source is divided by two to produce the internal bus
clock operating frequency, fop. The oscillator cannot be turned off by software unless the MOR bit, SWAIT,
is clear when a STOP instruction is executed.
Figure 1-2. Oscillator Connections
To VDD (or STOP)
(a)
Crystal or Ceramic
Resonator Connections
(b)
External Clock Source
Connections
OSC1
OSC2
MCU
37 pF
4.7 M
MCU
OSC1
OSC2
UNCONNECTED
EXTERNAL CLOCK
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相关代理商/技术参数
参数描述
MC68HC705P6ADW 制造商:Rochester Electronics LLC 功能描述:MCU, 176 BYTES RAM, A/D - Bulk
MC68HC705P6AMDW 功能描述:IC MCU 4.6K OTP 2.1MHZ 28-SOIC RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:HC05 标准包装:250 系列:56F8xxx 核心处理器:56800E 芯体尺寸:16-位 速度:60MHz 连通性:CAN,SCI,SPI 外围设备:POR,PWM,温度传感器,WDT 输入/输出数:21 程序存储器容量:40KB(20K x 16) 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:6K x 16 电压 - 电源 (Vcc/Vdd):2.25 V ~ 3.6 V 数据转换器:A/D 6x12b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:48-LQFP 包装:托盘 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323
MC68HC705P6AMP 制造商:Rochester Electronics LLC 功能描述:- Bulk
MC68HC705P6CDW 制造商:Motorola Inc 功能描述:
MC68HC705P6CP 制造商:Freescale Semiconductor 功能描述: 制造商:Motorola Inc 功能描述: