参数资料
型号: MC68HC705SR3PE
厂商: Freescale Semiconductor
文件页数: 75/96页
文件大小: 0K
描述: IC MCU 3.75K 2.1MHZ OTP 40-DIP
标准包装: 9
系列: HC05
核心处理器: HC05
芯体尺寸: 8-位
速度: 4MHz
外围设备: LED,POR
输入/输出数: 32
程序存储器容量: 3.75KB(3.75K x 8)
程序存储器类型: OTP
RAM 容量: 192 x 8
电压 - 电源 (Vcc/Vdd): 3 V ~ 5.5 V
数据转换器: A/D 4x8b
振荡器型: 内部
工作温度: 0°C ~ 70°C
封装/外壳: 40-DIP(0.600",15.24mm)
包装: 管件
MC68HC05SR3
Freescale
11-1
ELECTRICAL SPECIFICATIONS
11
ELECTRICAL SPECIFICATIONS
This section contains the electrical specifications for MC68HC05SR3.
11.1
Maximum Ratings
This device contains circuitry to protect the inputs against damage due to high static voltages or
electric fields. However, it is advised that normal precautions should be taken to avoid application
of any voltage higher than the maximum rated voltages to this high impedance circuit. For proper
operation
it
is
recommended
that
Vin
and
Vout
be
constrained
to
the
range
VSS≤(Vin or Vout)≤VDD. Reliability of operation is enhanced if unused inputs are connected to an
appropriate logic voltage level (e.g. either VSS or VDD).
11.2
Thermal Characteristics
(Voltages referenced to VSS)
RATINGS
SYMBOL
VALUE
UNIT
Supply Voltage
VDD
–0.3 to +7.0
V
Input Voltage
VIN
VSS–0.3 to VDD+0.3
V
VPP Pin
VIN
VSS–0.3 to 2xVDD+0.3
V
Current Drain per pin excluding VDD and VSS
ID
25
mA
Operating Temperature
Standard
Extended
TA
TL to TH
0 to +70
–40 to +85
°C
Storage Temperature Range
TSTG
–65 to +150
°C
CHARACTERISTICS
SYMBOL
VALUE
UNIT
Thermal resistance
DIP
SOIC
QFP
θJA
60
°C/W
TPG
75
05SR3.Book Page 1 Thursday, August 4, 2005 1:08 PM
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