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参数资料
| 型号： | MC7448VU867NC |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 41/60页 |
| 文件大小： | 0K |
| 描述： | IC MPU RISC 32BIT 360-FCCBGA |
| 标准包装： | 44 |
| 系列： | MPC74xx |
| 处理器类型： | 32-位 MPC74xx PowerPC |
| 速度： | 867MHz |
| 电压： | 1V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 360-CBGA，FCCBGA |
| 供应商设备封装： | 360-FCCBGA（25x25） |
| 包装： | 托盘 |
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MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
46
Freescale Semiconductor
System Design Information
9.7
Power and Thermal Management Information
This section provides thermal management information for the high coefficient of thermal expansion
(HCTE) package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The MPC7448 implements
several features designed to assist with thermal management, including DFS and the temperature diode.
DFS reduces the power consumption of the device by reducing the core frequency; see Section 9.7.5.1,
“Power Consumption with DFS Enabled,” for specific information regarding power reduction and DFS.
The temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see Section 9.7.4, “Temperature Diode,” for more
information.
To reduce the die-junction temperature, heat sinks may be attached to the package by several
methods—spring clip to holes in the printed-circuit board or package, and mounting clip and screw
assembly (see Figure 22); however, due to the potential large mass of the heat sink, attachment through the
printed-circuit board is suggested. In any implementation of a heat sink solution, the force on the die
should not exceed ten pounds (45 Newtons).
Figure 22. BGA Package Exploded Cross-Sectional View with Several Heat Sink Options
NOTE
A clip on heat sink is not recommended for LGA because there may not be
adequate clearance between the device and the circuit board. A through-hole
solution is recommended, as shown in Figure 23.
Thermal
Heat Sink
HCTE BGA Package
Heat Sink
Clip
Printed-Circuit Board
Interface Material
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相关代理商/技术参数 |
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| MC7448VU867ND | 功能描述:微处理器 - MPU APL8 RV2.2.1 1.0V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC7455_1102476 | 功能描述:4G LTE FB 3G HSPA+ GNSS NAM&EMEA 制造商:sierra wireless 系列:* 包装:剪切带（CT） 零件状态:在售 安装类型:卡边 封装/外壳:模块 标准包装:100 |
| MC7455_1103578 | 功能描述:4G LTE FB 3G HSPA+ GNSS NAM&EMEA 制造商:sierra wireless 系列:MC 零件状态:在售 功能:调制解调器 调制或协议:Beidou，Galileo，GLONASS，GPS，LTE，WCDMA 应用:通用 接口:USB 灵敏度:- 功率 - 输出:- 数据速率（最大值）:300Mbps 特性:- 电压 - 电源:- 标准包装:100 |
| MC7455ARX1000LF | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MC7455ARX1000LG | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
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