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参数资料
型号： MCIMX251AJM4A
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 400 MHz, MICROPROCESSOR, PBGA400
封装： 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400
文件页数： 44/140页
文件大小： 1416K
代理商： MCIMX251AJM4A
i.MX25 Applications Processor for Automotive Products, Rev. 8
138
Freescale Semiconductor
5
Revision History
Table 104 summarizes revisions to this document.
Table 104. Revision History
Rev.
Date
Revision
8
01/2011
Updated the first paragraph of Section 3.2.3, “SRTC DryIce Power-Up/Down Sequence.”
Updated Table 4, "Signal Considerations," on page 9 for NVCC_DRYICE signal.
Updated the third note for Table 6, "DC Operating Conditions," on page 11.
Added Table 9, "Recommended External Crystal Specifications," on page 13.
Added Table 10, "Recommended External Reference Clock Specifications," on page 13.
In Table 27, "AC Parameters for SDRAM I/O," on page 37, the frequency specification has been
updated to 133 MHz.
In Table 28, "AC Parameters for SDRAM pbijtov18_33_ddr_clk I/O," on page 38, the frequency
specification has been updated to 133 MHz.
Added a note for the line NVCC_DRYICE in Table 100, "17
×17 mm Package Ground, Power
Sense, and Reference Contact Assignments," on page 125.
Updated Table 101, "17×17 mm Package i.MX25 Signal Contact Assignment," on page 127.
7
-
This revision number was skipped so the Consumer/Industrial and Automotive revision numbers
can be in sync.
6
-
This revision number was skipped so the Consumer/Industrial and Automotive revision numbers
can be in sync.
5
09/2010
Added Section 3.2.3, “SRTC DryIce Power-Up/Down Sequence.”
4
08/2010
Updated Table 56, "WEIM Bus Timing Parameters," on page 71 to include new row for WE19.
Updated Table 6, "DC Operating Conditions," on page 11 to include Min and Max values of
FUSE_VDD.
3
06/2010
Updated Table 1, “Ordering Information,” to include new part numbers.
2
03/2010
Updated Table 1, “Ordering Information,” to include new part numbers.
Added Table 2, “i.MX25 Parts Functional Differences.”
Added Section 3.3, “Power Characteristics.”
1
10/2009
Updated Table 1, “Ordering Information,” to include new part numbers.
Updated DRYICE description in Table 3, “i.MX25 Digital and Analog Modules.”
Updated REF signal description in Table 4, “Signal Considerations.”
Updated ESD damage immunity values in Table 5, “DC Absolute Maximum Ratings.”
Updated values in Table 13, “i.MX25 Power Mode Current Consumption.”
Added a note on timing in Section 3.2.1, “Power-Up Sequence.”
Added Table 14, “iMX25 Reduced Power Mode Current Consumption.”
Updated Table 55, “NFC Timing Parameters.”
Updated values in Table 56, “WEIM Bus Timing Parameters.
Updated Table 85, “Touchscreen ADC Electrical Specifications.”
0
6/2009
Initial release.
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相关代理商/技术参数
参数描述
MCIMX251AJM4AR2 功能描述:处理器 - 专门应用 IMX25 1.2 AUTO RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432
MCIMX251AVM4 功能描述:处理器 - 专门应用 SENNA IMX25 1.1 AUTO RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432
MCIMX253CJM4 功能描述:处理器 - 专门应用 IMX25 INDUSTRIAL RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432
MCIMX253CJM4A 功能描述:处理器 - 专门应用 IMX25 1.2 INDUST RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432
MCIMX253CVM4 功能描述:处理器 - 专门应用 SENNA IMX25 1.1 INDUSTRIAL RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432
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