参数资料
型号: MCIMX251AJM4A
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 400 MHz, MICROPROCESSOR, PBGA400
封装: 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400
文件页数: 52/140页
文件大小: 1416K
代理商: MCIMX251AJM4A
i.MX25 Applications Processor for Automotive Products, Rev. 8
Freescale Semiconductor
19
The method for obtaining the maximum current is as follows:
1. Measure the worst case power consumption on individual rails using directed test on i.MX25.
2. Correlate the worst case power consumption power measurements with the worst case power
consumption simulations.
3. Combine common voltage rails based on the power supply sequencing requirements (add the
worst case power consumption on each rail within some test cases from several test cases run, to
maximize different rails in the power group).
4. Guard the worst case numbers for temperature and process variation.
5. The sum of individual rails is greater than the real world power consumption, since a real
system does not typically maximize the power consumption on all peripherals
simultaneously.
6. BATT_VDD current is measured when the system is in reduced power mode maintaining the
RTC. When the system is in run mode, QVDD is used to supply the DryIce, so this current
becomes negligible. Refer to Table 12, for more details on the power modes.
NOTE
The values mentioned above should not be taken as a typical max run data
for specific use cases. These values are Absolute MAX data. Freescale
recommends that the system current measurements are taken with
customer-specific use-cases to reflect normal operating conditions in the
end system
3.4
Thermal Characteristics
The thermal resistance characteristics for the device are given in Table 16. These values are measured
under the following conditions:
Two-layer substrate
Substrate solder mask thickness: 0.025 mm
Substrate metal thicknesses: 0.016 mm
Substrate core thickness: 0.200 mm
Core through I.D: 0.118 mm, Core through plating 0.016 mm.
Flag: Trace style with ground balls under the die connected to the flag
USBPHY1_VDDA_BIAS, USBPHY1_UPLL_VDD,
USBPHY1_VDDA, USBPHY2_VDD,
OSC24M_VDD, NVCC_ADC
3.3
40
FUSE_VDD1
3.6
62
BATT_VDD
1.55
0.030
1 The FUSE_VDD rail is connected to ground. it only needs a voltage if the system fuse burning is needed.
Table 15. Power Consumption (continued)
Power Supply
Voltage (V)
Max Current (mA)
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相关代理商/技术参数
参数描述
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MCIMX251AVM4 功能描述:处理器 - 专门应用 SENNA IMX25 1.1 AUTO RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432
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