参数资料
型号: MCIMX31VMN5CR2
厂商: Freescale Semiconductor
文件页数: 2/122页
文件大小: 0K
描述: IC MPU MAP I.MX31L 473-MAPBGA
标准包装: 750
系列: i.MX31
核心处理器: ARM11
芯体尺寸: 32-位
速度: 532MHz
连通性: 1 线,ATA,EBI/EMI,FIR,I²C,MMC/SD,PCMCIA,SIM,SPI,SSI,UART/USART,USB,USB OTG
外围设备: DMA,LCD,POR,PWM,WDT
程序存储器类型: ROMless
RAM 容量: 16K x 8
电压 - 电源 (Vcc/Vdd): 1.22 V ~ 3.3 V
振荡器型: 外部
工作温度: 0°C ~ 70°C
封装/外壳: 473-LFBGA
包装: 带卷 (TR)
MCIMX31/MCIMX31L Technical Data, Rev. 4.1
10
Freescale Semiconductor
Electrical Characteristics
4
Electrical Characteristics
This section provides the device-level and module-level electrical characteristics for the MCIMX31.
4.1
Chip-Level Conditions
This section provides the device-level electrical characteristics for the IC. See Table 4 for a quick reference
to the individual tables and sections.
CAUTION
Stresses beyond those listed under Table 5 may cause permanent damage to
the device. These are stress ratings only. Functional operation of the device
at these or any other conditions beyond those indicated under Table 8,
"Operating Ranges," on page 13 is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device
reliability.
Table 4. MCIMX31 Chip-Level Conditions
For these characteristics, …
Topic appears …
Table 5. Absolute Maximum Ratings
Parameter
Symbol
Min
Max
Units
Supply Voltage (Core)
QVCCmax
–0.5
1.65
V
Supply Voltage (I/O)
NVCCmax
–0.5
3.3
V
Input Voltage Range
VImax
–0.5
NVCC +0.3
V
Storage Temperature
Tstorage
–40
125
oC
ESD Damage Immunity:
Vesd
V
Human Body Model (HBM)
1500
Machine Model (MM)
200
Charge Device Model (CDM)
500
Offset voltage allowed in run mode between core supplies.
Vcore_offset
1
1 The offset is the difference between all core voltage pair combinations of QVCC, QVCC1, and QVCC4.
—15
mV
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
i.MX31
Product
Family
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