参数资料
型号: MCP23S09-E/SO
厂商: Microchip Technology
文件页数: 22/50页
文件大小: 0K
描述: IC I/O EXPANDER SPI 8B 18SOIC
标准包装: 42
接口: SPI
输入/输出数: 8
中断输出:
频率 - 时钟: 10MHz
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 18-SOIC(0.295",7.50mm 宽)
供应商设备封装: 18-SOIC
包装: 管件
产品目录页面: 684 (CN2011-ZH PDF)
2009 Microchip Technology Inc.
DS22121B-page 29
MCP23009/MCP23S09
2.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings ()
Ambient temperature under bias............................................................................................................ .-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.0V
Voltage on RESET with respect to VSS ..................................................................................................... -0.3V to +14V
Voltage on all other pins with respect to VSS (except VDD and GPIOA/B) ..................................... -0.6V to (VDD + 0.6V)
Voltage on GPIO Pins: ................................................................................................................................. -0.6V to 5.5V
Total power dissipation (Note 1)...........................................................................................................................700 mW
Maximum current out of VSS pin ...........................................................................................................................200 mA
Maximum current into VDD pin .............................................................................................................................. 125 mA
Input clamp current, IIK (VI < 0 or VI > VDD)
...................................................................................................................... ±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD)
.............................................................................................................. ±20 mA
Maximum output current sunk by any Output pin....................................................................................................25 mA
Maximum output current sunk by any Output pin (VDD = 1.8V) ..............................................................................10 mA
Note:
Power dissipation is calculated as follows:
Pdis = VDD x {IDD -
∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
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