参数资料
型号: MK10N512VMD100
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA144
封装: 13 X 13 MM, MAPBGA-144
文件页数: 13/59页
文件大小: 1671K
代理商: MK10N512VMD100
5.3.2 Thermal attributes
Board
type
Symbol
Description
144
LQFP
144
MAPBGA
Unit
Notes
Single-
layer (1s)
RθJA
Thermal resistance, junction to ambient (natural
convection)
52
50
°C/W
Four-layer
(2s2p)
RθJA
Thermal resistance, junction to ambient (natural
convection)
44
30
°C/W
Single-
layer (1s)
RθJMA
Thermal resistance, junction to ambient (200 ft./
min. air speed)
43
41
°C/W
Four-layer
(2s2p)
RθJMA
Thermal resistance, junction to ambient (200 ft./
min. air speed)
38
27
°C/W
RθJB
Thermal resistance, junction to board
33
17
°C/W
RθJC
Thermal resistance, junction to case
11
10
°C/W
ΨJT
Thermal characterization parameter, junction to
package top outside center (natural convection)
2
°C/W
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
6 Peripheral operating requirements and behaviors
6.1 Core modules
6.1.1 Debug trace timing specifications
Table 10. Debug trace operating behaviors
Symbol
Description
Min.
Max.
Unit
Tcyc
Clock period
Frequency dependent
MHz
Twl
Low pulse width
2
ns
Twh
High pulse width
2
ns
Tr
Clock and data rise time
3
ns
Tf
Clock and data fall time
3
ns
Ts
Data setup
3
ns
Th
Data hold
2
ns
Peripheral operating requirements and behaviors
K10 Sub-Family Product Preview Data Sheet, Rev. 2, 3/2011.
20
Preliminary
Freescale Semiconductor, Inc.
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