参数资料
型号: MPC740ARX266TX
厂商: MOTOROLA INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255
封装: 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
文件页数: 19/44页
文件大小: 280K
代理商: MPC740ARX266TX
26
MPC750A RISC Microprocessor Hardware Specications
Pinout Listings
Table 16 provides the pinout listing for the MPC750, 360 CBGA package.
QACK
D3
Low
Input
QREQ
J3
Low
Output
RSRV
D1
Low
Output
SMI
A16
Low
Input
SRESET
B14
Low
Input
SYSCLK
C9
Input
TA
H14
Low
Input
TBEN
C2
High
Input
TBST
A14
Low
I/O
TCK
C11
High
Input
TDI
A11
High
Input
TDO
A12
High
Output
TEA
H13
Low
Input
TLBISYNC
C4
Low
Input
TMS
B11
High
Input
TRST
C10
Low
Input
TS
J13
Low
I/O
TSIZ[0–2]
A13, D10, B12
High
Output
TT[0–4]
B13, A15, B16, C14, C15
High
I/O
WT
D2
Low
Output
VDD 2
F6, F8, F9, F11, G7, G10, H6, H8, H9, H11, J6, J8, J9, J11, K7, K10, L6,
L8, L9, L11
——
VOLTDET 3
F3
High
Output
Notes:
1. These are test signals for factory use only and must be pulled up to OVdd for normal machine operation.
2. OVdd inputs supply power to the I/O drivers and Vdd inputs supply power to the processor core.
3. Internally tied to GND in the MPC740 CBGA package to indicate to the power supply that a low-voltage processor
is present. This signal is not a power supply input.
Table 16. Pinout Listing for the MPC750, 360 CBGA Package
Signal Name
Pin Number
Active
I/O
A[0–31]
A13, D2, H11, C1, B13, F2, C13, E5, D13, G7, F12, G3, G6, H2, E2, L3,
G5, L4, G4, J4, H7, E1, G2, F3, J7, M3, H3, J2, J6, K3, K2, L2
High
I/O
AACK
N3
Low
Input
ABB
L7
Low
I/O
AP[0–3]
C4, C5, C6, C7
High
I/O
ARTRY
L6
Low
I/O
AVDD
A8
——
BG
H1
Low
Input
Table 15. Pinout Listing for the MPC740, 255 CBGA Package (Continued)
Signal Name
Pin Number
Active
I/O
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