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| 型号： | MPC740ARX266TX |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255 |
| 封装： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件页数： | 36/44页 |
| 文件大小： | 280K |
| 代理商： | MPC740ARX266TX |
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MPC750A RISC Microprocessor Hardware Specications
41
System Design Information
Figure 23. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7 °C/W, thus
Tj = 30 °C + 5 °C + (2.2 °C/W +1.0 °C/W + 7 °C/W) * 4.5 W,
resulting in a die-junction temperature of approximately 81 °C which is well within the maximum
operating temperature of the component.
Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Wakeeld Engineering, and Aavid
Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need air ow.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
gure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat ow. The nal die-junction
operating temperature, is not only a function of the component-level thermal resistance, but the
system-level design and its operating conditions. In addition to the component's power consumption, a
number of factors affect the nal operating die-junction temperature—airow, board population (local heat
ux of adjacent components), heat sink efciency, heat sink attach, heat sink placement, next-level
interconnect technology, system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection
and conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models
for the board, as well as, system-level designs.
To expedite system-level thermal analysis, several
“compact” thermal-package models are available within FLOTHERM.
These are available upon
request.
1
3
5
7
8
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin-fin Heat Sink
Approach Air Velocity (m/s)
Heat
Sink
Thermal
Resistance
(C/W)
(25 x28 x 15 mm)
2
4
6
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