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| 型号： | MPC740ARX266TX |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255 |
| 封装： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件页数： | 37/44页 |
| 文件大小： | 280K |
| 代理商： | MPC740ARX266TX |
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42
MPC750A RISC Microprocessor Hardware Specications
Document Revision History
1.9 Document Revision History
1.10 Ordering Information
This section provides the part numbering nomenclature for the MPC750. Note that the individual part
numbers correspond to a maximum processor core frequency. For available frequencies, contact your local
Motorola sales ofce.
Figure 24 provides the Motorola part numbering nomenclature for the MPC750. In addition to the
processor frequency, the part numbering scheme also consists of a part modier and application modier.
The part modier indicates any enhancement(s) in the part from the original production design. The bus
divider may specify special bus frequencies or application conditions. Each part number also contains a
Table 20. Document Revision History
Document
Revision
Substantive Change(s)
Rev 1
Modied introduction to indicate this document also addresses MPC750P parts fabricated in .19
process with attendant changes in supply voltages and electrical characteristics.
Changed Section 1.3, “General Parameters,” to include new Technology, Die size, and Core power
supply for MPC750P.
Changed Table 2 to include absolute maximum supply voltage for MPC750P.
Changed Table 3 to include recommended supply voltages for MPC750P and extended L2 bus
supply voltage down to 2.5V for all parts.
Added Table 7 to provide power consumption of MPC750P.
Changed Table 8, Table 9, and Table 10 to show test conditions appropriate to the process and add
300 MHz to AC specications.
Changed Table 9 to reduce input hold time (spec 11a and 11b) from 1ns to 0ns for all CPU
frequencies.
Changed Table 11, Table 12 and Table 13 to show extended test conditions for L2OVdd and add
300MHz to AC specications.
Changed Table 13 and Table 14 to show test conditions appropriate to the process.
Rev 2
Removed Preliminary overlay from document
Deleted electrical specications for the MPC750P part and created a separate specication
describing the unique operating conditions of that part.
Corrected Active polarity of CKSTP_OUT, CKSTP_IN, L2CE, L2WE, L2SYNC_IN, L2SYNC_OUT in
Table 17.
Added extended junction temperature parts to Table 3.
Rev 2.1
Removed 333MHz column from Table 13.
Rev 2.2
In Table 7, Maximum sleep power is increased to 300 mW.
Rev 2.3
Corrected Figure 16 and Figure 17, which omitted some dimensions due to format error.
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