参数资料
型号: MPC740ARX266TX
厂商: MOTOROLA INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255
封装: 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
文件页数: 22/44页
文件大小: 280K
代理商: MPC740ARX266TX
MPC750A RISC Microprocessor Hardware Specications
29
Package Description
1.7 Package Description
The following sections provide the package parameters and mechanical dimensions for the MPC740, 255
CBGA packages.
1.7.1 Parameters for the MPC740
The package parameters are as provided in the following list. The package type is 21 x 21 mm, 255-lead
ceramic ball grid array (CBGA).
Package outline
21 x 21 mm
Interconnects
255 (16 x 16 ball array - 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.45 mm
Maximum module height
3.00 mm
Ball diameter
0.89 mm (35 mil)
1.7.2 Mechanical Dimensions of the MPC740
Figure 16 provides the mechanical dimensions and bottom surface nomenclature of the MPC740, 255
CBGA package.
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