参数资料
型号: MPC745BPX350LE
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255
封装: 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255
文件页数: 10/60页
文件大小: 1559K
代理商: MPC745BPX350LE
MPC755 RISC Microprocessor Hardware Specifications, Rev. 7.0
18
Freescale Semiconductor
Electrical and Thermal Characteristics
Table 11. L2CLK Output AC Timing Specification
At recommended operating conditions (see Table 3)
Parameter
Symbol
All Speed Grades
Unit
Notes
Min
Max
L2CLK frequency
fL2CLK
80
450
MHz
1, 4
L2CLK cycle time
tL2CLK
2.5
12.5
ns
L2CLK duty cycle
tCHCL/tL2CLK
45
55
%
2, 7
Internal DLL-relock time
640
L2CLK
3, 7
DLL capture window
0
10
ns
5, 7
L2CLK_OUT output-to-output skew
tL2CSKW
—50
ps
6, 7
L2CLK_OUT output jitter
±150
ps
6, 7
Notes:
1. L2CLK outputs are L2CLK_OUTA, L2CLK_OUTB, L2CLK_OUT, and L2SYNC_OUT pins. The L2CLK
frequency-to-core frequency settings must be chosen such that the resulting L2CLK frequency and core frequency
do not exceed their respective maximum or minimum operating frequencies. The maximum L2LCK frequency will
be system dependent. L2CLK_OUTA and L2CLK_OUTB must have equal loading.
2. The nominal duty cycle of the L2CLK is 50% measured at midpoint voltage.
3. The DLL-relock time is specified in terms of L2CLK periods. The number in the table must be multiplied by the period
of L2CLK to compute the actual time duration in ns. Relock timing is guaranteed by design and characterization.
4. The L2CR[L2SL] bit should be set for L2CLK frequencies less than 110 MHz. This adds more delay to each tap of
the DLL.
5. Allowable skew between L2SYNC_OUT and L2SYNC_IN.
6. This output jitter number represents the maximum delay of one tap forward or one tap back from the current DLL
tap as the phase comparator seeks to minimize the phase difference between L2SYNC_IN and the internal L2CLK.
This number must be comprehended in the L2 timing analysis. The input jitter on SYSCLK affects L2CLK_OUT and
the L2 address/data/control signals equally and, therefore, is already comprehended in the AC timing and does not
have to be considered in the L2 timing analysis.
7. Guaranteed by design.
相关PDF资料
PDF描述
MPC755BPX350LE 32-BIT, 350 MHz, RISC PROCESSOR, PBGA360
MPC755CPX400LE 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360
MPC745BVT300LE 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
MPC755BVT300LE 32-BIT, 300 MHz, RISC PROCESSOR, PBGA360
MPC823ZC25 32-BIT, RISC PROCESSOR, PBGA256
相关代理商/技术参数
参数描述
MPC745BVT300LE 功能描述:微处理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC745BVT350LE 功能描述:微处理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC745CPX350LE 功能描述:微处理器 - MPU GF REV 2.8 105C 6W RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC745CPX350LE 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 350MHZ 255-FCPBGA
MPC745CVT350LE 功能描述:微处理器 - MPU GF REV2.8@6W RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324