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| 型号： | MPC745BPX350LE |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255 |
| 封装： | 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255 |
| 文件页数： | 44/60页 |
| 文件大小： | 1559K |
| 代理商： | MPC745BPX350LE |
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MPC755 RISC Microprocessor Hardware Specifications, Rev. 7.0
Freescale Semiconductor
49
System Design Information
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
8.8.3
Heat Sink Selection Example
This section provides a heat sink selection example using one of the commercially-available heat sinks.
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
Tj = Ta + Tr + (θjc + θint + θsa) × Pd
where:
Tj is the die-junction temperature
Ta is the inlet cabinet ambient temperature
Tr is the air temperature rise within the computer cabinet
θ
jc is the junction-to-case thermal resistance
θ
int is the adhesive or interface material thermal resistance
θ
sa is the heat sink base-to-ambient thermal resistance
Pd is the power dissipated by the device
During operation the die-junction temperatures (Tj) should be maintained less than the value specified in
Table 3. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (Ta)
may range from 30° to 40°C. The air temperature rise within a cabinet (Tr) may be in the range of 5° to
10°C. The thermal resistance of the thermal interface material (
θ
int) is typically about 1°C/W. Assuming
a Ta of 30°C, a Tr of 5°C, a CBGA package Rθjc < 0.1, and a power consumption (Pd) of 5.0 W, the
following expression for Tj is obtained:
Die-junction temperature:
Tj = 30°C + 5°C + (0.1°C/W + 1.0°C/W + θsa) × 5.0 W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
sa) versus airflow
velocity is shown in Figure 28.
Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7°C/W, thus
Tj = 30°C + 5°C + (0.1°C/W + 1.0°C/W + 7°C/W) × 5.0 W,
resulting in a die-junction temperature of approximately 76°C which is well within the maximum
operating temperature of the component.
Other heat sinks offered by Aavid Thermalloy, Alpha Novatech, The Bergquist Company, IERC, Chip
Coolers, and Wakefield Engineering offer different heat sink-to-ambient thermal resistances, and may or
may not need airflow.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC745BVT300LE | 功能描述:微处理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC745BVT350LE | 功能描述:微处理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC745CPX350LE | 功能描述:微处理器 - MPU GF REV 2.8 105C 6W RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC745CPX350LE | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 350MHZ 255-FCPBGA |
| MPC745CVT350LE | 功能描述:微处理器 - MPU GF REV2.8@6W RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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