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| 型号： | MPC745BPX350LE |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255 |
| 封装： | 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255 |
| 文件页数： | 42/60页 |
| 文件大小： | 1559K |
| 代理商： | MPC745BPX350LE |
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MPC755 RISC Microprocessor Hardware Specifications, Rev. 7.0
Freescale Semiconductor
47
System Design Information
Figure 26. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
8.8.2
Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip
mechanism, Figure 27 shows the thermal performance of three thin-sheet thermal-interface materials
(silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing contact
pressure. The use of thermal grease significantly reduces the interface thermal resistance. That is, the bare
joint results in a thermal resistance approximately seven times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 25). This spring force should not exceed 5.5 pounds of force. Therefore, the synthetic grease offers
the best thermal performance, considering the low interface pressure. Of course, the selection of any
thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, etc.
Figure 27 describes the thermal performance of select thermal interface materials.
External Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
(Note the internal versus external package resistance.)
Internal Resistance
Die/Package
Package/Leads
Die Junction
相关PDF资料 |
PDF描述 |
|---|---|
| MPC755BPX350LE | 32-BIT, 350 MHz, RISC PROCESSOR, PBGA360 |
| MPC755CPX400LE | 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360 |
| MPC745BVT300LE | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255 |
| MPC755BVT300LE | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA360 |
| MPC823ZC25 | 32-BIT, RISC PROCESSOR, PBGA256 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC745BVT300LE | 功能描述:微处理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC745BVT350LE | 功能描述:微处理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC745CPX350LE | 功能描述:微处理器 - MPU GF REV 2.8 105C 6W RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC745CPX350LE | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 350MHZ 255-FCPBGA |
| MPC745CVT350LE | 功能描述:微处理器 - MPU GF REV2.8@6W RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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