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| 型号： | MPC755CPX400LE |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 4/56页 |
| 文件大小： | 0K |
| 描述： | IC MPU PPC 400MHZ 360-FCPBGA |
| 标准包装： | 44 |
| 系列： | MPC7xx |
| 处理器类型： | 32-位 MPC7xx PowerPC |
| 速度： | 400MHz |
| 电压： | 2V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 360-BBGA，FCCBGA |
| 供应商设备封装： | 360-FCCBGA（25x25） |
| 包装： | 托盘 |
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MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
12
Freescale Semiconductor
Electrical and Thermal Characteristics
4.2
AC Electrical Characteristics
This section provides the AC electrical characteristics for the MPC755. After fabrication, functional parts
are sorted by maximum processor core frequency as shown in Section 4.2.1, “Clock AC Specifications,”
and tested for conformance to the AC specifications for that frequency. The processor core frequency is
determined by the bus (SYSCLK) frequency and the settings of the PLL_CFG[0:3] signals. Parts are sold
by maximum processor core frequency; see Section 10, “Ordering Information.”
4.2.1
Clock AC Specifications
Table 8. Clock AC Timing Specifications
At recommended operating conditions (see Table 3)
Characteristic
Symbol
Maximum Processor Core Frequency
Unit
Notes
300 MHz
350 MHz
400 MHz
Min
Max
Min
Max
Min
Max
Processor frequency
fcore
200
300
200
350
200
400
MHz
1
VCO frequency
fVCO
400
600
400
700
400
800
MHz
1
SYSCLK frequency
fSYSCLK
25
100
25
100
25
100
MHz
1
SYSCLK cycle time
tSYSCLK
10
40
10
40
10
40
ns
SYSCLK rise and fall time
tKR, tKF
—2.0
ns
2
tKR, tKF
—1.4
ns
2
SYSCLK duty cycle measured at
OVDD/2
tKHKL/
tSYSCLK
40
60
40
60
40
60
%
3
SYSCLK jitter
—
±150
—
±150
—
±150
ps
3, 4
Internal PLL relock time
—100
μs3, 5
Notes:
1. Caution: The SYSCLK frequency and PLL_CFG[0:3] settings must be chosen such that the resulting SYSCLK (bus)
frequency, CPU (core) frequency, and PLL (VCO) frequency do not exceed their respective maximum or minimum operating
frequencies. Refer to the PLL_CFG[0:3] signal description in Section 8.1, “PLL Configuration
,” for valid PLL_CFG[0:3]
settings.
2. Rise and fall times measurements are now specified in terms of slew rates, rather than time to account for selectable I/O bus
interface levels. The minimum slew rate of 1 V/ns is equivalent to a 2 ns maximum rise/fall time measured at 0.4 and 2.4 V
(OVDD = 3.3 V) or a rise/fall time of 1 ns measured at 0.4 and 1.8 V (OVDD = 2.5 V).
3. Timing is guaranteed by design and characterization.
4. This represents total input jitter—short term and long term combined—and is guaranteed by design.
5. Relock timing is guaranteed by design and characterization. PLL-relock time is the maximum amount of time required for PLL
lock after a stable VDD and SYSCLK are reached during the power-on reset sequence. This specification also applies when
the PLL has been disabled and subsequently re-enabled during sleep mode. Also note that HRESET must be held asserted
for a minimum of 255 bus clocks after the PLL-relock time during the power-on reset sequence.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC755CPX400LE | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ BGA-360 |
| MPC755CPX400LER2 | 功能描述:微处理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC755CRX350LE | 功能描述:微处理器 - MPU 360CBGA,RV2.8,6W RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC755CRX350TE | 功能描述:微处理器 - MPU 360CBGA,RV2.8, RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC755CRX400LE | 功能描述:微处理器 - MPU GF RV2.84A105C 360CBGA RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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