参数资料
型号: MPC8240LZU250X
厂商: MOTOROLA INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 250 MHz, RISC PROCESSOR, PBGA352
封装: TBGA-352
文件页数: 39/52页
文件大小: 542K
代理商: MPC8240LZU250X
44
MPC8240 (rev0.5) Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
Figure 26. Die Junction-to-Ambient Resistance
The board designer can choose between several types of heat sinks to place on the MPC8240. There are
several commercially-available heat sinks for the MPC8240 provided by the following vendors:
Chip Coolers Inc.
800-227-0254 (USA/Canada)
333 Strawberry Field Rd.
401-739-7600
Warwick, RI 02887-6979
Internet: www.chipcoolers.com
International Electronic Research Corporation (IERC)818-842-7277
135 W. Magnolia Blvd.
Burbank, CA 91502
Internet: www.ctscorp.com
Thermalloy
972-243-4321
2021 W. Valley View Lane
Dallas, TX 75234-8993
Internet: www.thermalloy.com
2
4
6
8
10
12
14
16
18
0
0.5
1
1.5
2
2.5
Die
J
unction-to-Ambient
Thermal
Resistance
(C/W)
Airflow Velocity (m/s)
No heat sink and high thermal board-level loading of
adjacent components
No heat sink and low thermal board-level loading of
adjacent components
Attached heat sink and high thermal board-level loading of
adjacent components
Attached heat sink and low thermal board-level loading of
adjacent components
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