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参数资料
| 型号： | MPC8240LZU250X |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 250 MHz, RISC PROCESSOR, PBGA352 |
| 封装： | TBGA-352 |
| 文件页数： | 41/52页 |
| 文件大小： | 542K |
| 代理商： | MPC8240LZU250X |
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46
MPC8240 (rev0.5) Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
thermal contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 28 shows the thermal performance of three thin-sheet thermal-interface materials (silicone, graphite/
oil, oroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure. As shown,
the performance of these thermal interface materials improves with increasing contact pressure. The use of
thermal grease signicantly reduces the interface thermal resistance. That is, the bare joint results in a
thermal resistance approximately 7 times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 27). Therefore, the synthetic grease offers the best thermal performance, considering the low
interface pressure. Of course, the selection of any thermal interface material depends on many factors—
thermal performance requirements, manufacturability, service temperature, dielectric properties, cost, etc.
Figure 28. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
PO Box 0997
Midland, MI 48686-0997
Internet: www.dow.com
0
0.5
1
1.5
2
0
1020304050607080
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
Contact Pressure (PSI)
Specific
Thermal
Resistance
(Kin
2
/W)
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