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参数资料
型号： MPC8245TVV266D
厂商： MOTOROLA INC
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 266 MHz, RISC PROCESSOR, PBGA352
封装： 35 X 35 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
文件页数： 4/60页
文件大小： 674K
代理商： MPC8245TVV266D
12
MPC8245 Integrated Processor Hardware Specications
MOTOROLA
Electrical and Thermal Characteristics
1.4.2
Thermal Characteristics
Table 6 provides the package thermal characteristics for the MPC8245. For further information, see
Section 1.7.9, “Thermal Management Information.”
1.4.3
AC Electrical Characteristics
This section provides the AC electrical characteristics for the MPC8245. After fabrication, functional parts
are sorted by maximum processor core frequency as shown in Table 7 and tested for conformance to the AC
specications for that frequency. The processor core frequency is determined by the bus (PCI_SYNC_IN)
clock frequency and the settings of the PLL_CFG[0:4] signals. Parts are sold by maximum processor core
frequency. See Section 1.9, “Ordering Information.”
Table 7 provides the operating frequency information for the MPC8245 at recommended operating
conditions (see Table 2) with LVDD = 3.3 V ± 0.3 V.
Table 6. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection
(Single-layer board—1s)
RθJA
16.1
°C/W
1, 2
Junction-to-ambient natural convection
(Four-layer board—2s2p)
RθJMA
12.0
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
(Single-layer board—1s)
RθJMA
11.6
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
(Four layer board—2s2p)
RθJMA
9.0
°C/W
1, 3
Junction-to-board
RθJB
4.8
°C/W
4
Junction-to-case
RθJC
1.8
°C/W
5
Junction-to-package top (natural convection)
Ψ
JT
1.0
°C/W
6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, airow, power dissipation of other components on the board, and board
thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate used for case temperature.
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written as Psi-JT.
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