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| 型号： | MPC8308-KIT |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 73/83页 |
| 文件大小： | 0K |
| 描述： | KIT EVALUATION FOR MPC830X |
| 标准包装： | 1 |
| 系列： | PowerQUICC II™ PRO |
| 类型： | MPU |
| 适用于相关产品： | MPC8308 |
| 所含物品： | 板，线缆，CD，电源 |
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MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3
Freescale Semiconductor
75
Thermal
22.1
Thermal Characteristics
This table provides the package thermal characteristics for the 473, 19
19 mm MAPBGA.
22.2
Thermal Management Information
For the following sections, PD = (VDD IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers.
22.2.1
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RJA PD)
where:
TJ = junction temperature (C)
TA = ambient temperature for the package (C)
RJA = junction-to-ambient thermal resistance (C/W)
PD = power dissipation in the package (W)
The junction-t-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. As a general statement, the value obtained on a single layer board is
Table 59. Package Thermal Characteristics for MAPBGA
Characteristic
Board Type
Symbol
Value
Unit
Note
Junction to Ambient Natural Convection
Single layer board (1s)
RJA
42
°C/W
1, 2
Junction to Ambient Natural Convection
Four layer board (2s2p)
RJA
27
°C/W
1, 2, 3
Junction to Ambient (@200 ft/min)
Single layer board (1s)
RJMA
35
°C/W
1, 3
Junction to Ambient (@200 ft/min)
Four layer board (2s2p)
RJMA
24
°C/W
1, 3
Junction to Board
—
RJB
17
°C/W
4
Junction to Case
—
RJC
9°C/W
5
Junction to Package Top
Natural Convection
JT
2°C/W
6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
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