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参数资料
型号： MPC8314VRAGDA
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： MICROPROCESSOR, PBGA620
封装： 29 X 29 MM, LEAD FREE, PLASTIC, TEPBGA-620
文件页数： 103/106页
文件大小： 1253K
代理商： MPC8314VRAGDA
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 0
96
Freescale Semiconductor
Thermal (Preliminary)
24 Thermal (Preliminary)
This section describes the thermal specifications of the MPC8314E.
24.1
Thermal Characteristics
Table 74 provides the package thermal characteristics for the 620 29
× 29 mm TEPBGA II.
3
0010
0000100
66.67
133.33
266.66
4
0100
0000101
33.33
133.33
333.33
5
0101
0000101
25
125
312.5
6
0010
0000101
66.67
133.33
333.33
7
0101
0000110
25
125
375
8
0100
0000110
33.33
133.33
400
9
0010
0000110
66.67
133.33
400
Table 74. Package Thermal Characteristics for TEPBGA II
Characteristic
Board type
Symbol
Value
Unit
Notes
Junction to ambient natural convection
Single layer board (1s)
RθJA
23
°C/W
1, 2
Junction to ambient natural convection
Four layer board (2s2p)
RθJA
16
°C/W
1, 2, 3
Junction to ambient (@200 ft/min)
Single layer board (1s)
RθJMA
18
°C/W
1, 3
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
RθJMA
13
°C/W
1, 3
Junction to board
—
RθJB
8°C/W
4
Junction to case
—
RθJC
6°C/W
5
Junction to package top
Natural convection
Ψ
JT
6°C/W
6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
as Psi-JT.
Table 73. Suggested PLL Configurations
Conf. No.
SPMF
Core\PLL
Input Clock Frequency (MHz) CSB Frequency (MHz) Core Frequency (MHz)
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