参数资料
型号: MPC8555ECPXAKF
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: RISC PROCESSOR, PBGA783
封装: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件页数: 19/88页
文件大小: 1110K
代理商: MPC8555ECPXAKF
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 4.2
26
Freescale Semiconductor
Ethernet: Three-Speed, MII Management
8.2.3
MII AC Timing Specifications
This section describes the MII transmit and receive AC timing specifications.
8.2.3.1
MII Transmit AC Timing Specifications
Table 22 provides the MII transmit AC timing specifications.
Figure 10 shows the MII transmit AC timing diagram.
Figure 10. MII Transmit AC Timing Diagram
Table 22. MII Transmit AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
TX_CLK clock period 10 Mbps
tMTX
2
400
ns
TX_CLK clock period 100 Mbps
tMTX
—40
ns
TX_CLK duty cycle
tMTXH/tMTX
35
65
%
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
tMTKHDX
15
ns
TX_CLK data clock rise and fall time
tMTXR, tMTXF
2,3
1.0
4.0
ns
Notes:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX
symbolizes MII transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid
(X). Note that, in general, the clock reference symbol representation is based on two to three letters representing the clock
of a particular functional. For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall
times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2. Signal timings are measured at 0.7 V and 1.9 V voltage levels.
3. Guaranteed by design.
TX_CLK
TXD[3:0]
tMTKHDX
tMTX
tMTXH
tMTXR
tMTXF
TX_EN
TX_ER
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