参数资料
型号: MPC8555VTAPFX
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 833 MHz, RISC PROCESSOR, PBGA783
封装: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
文件页数: 25/88页
文件大小: 1244K
代理商: MPC8555VTAPFX
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
31
Ethernet: Three-Speed, MII Management
Figure 13 shows the RBMII and RTBI AC timing and multiplexing diagrams.
Figure 13. RGMII and RTBI AC Timing and Multiplexing Diagrams
8.3
Ethernet Management Interface Electrical Characteristics
The electrical characteristics specified here apply to MII management interface signals MDIO
(management data input/output) and MDC (management data clock). The electrical characteristics for
GMII, RGMII, TBI and RTBI are specified in Section 8.1, “Three-Speed Ethernet Controller (TSEC)
8.3.1
MII Management DC Electrical Characteristics
The MDC and MDIO are defined to operate at a supply voltage of 3.3 V. The DC electrical characteristics
for MDIO and MDC are provided in Table 27.
Table 27. MII Management DC Electrical Characteristics
Parameter
Symbol
Conditions
Min
Max
Unit
Supply voltage (3.3 V)
OVDD
3.13
3.47
V
Output high voltage
VOH
IOH = –1.0 mA
LVDD = Min
2.10
LVDD + 0.3
V
Output low voltage
VOL
IOL = 1.0 mA
LVDD = Min
GND
0.50
V
Input high voltage
VIH
—1.70
V
Input low voltage
VIL
——
0.90
V
GTX_CLK
tRGT
tRGTH
tSKRGT
TX_CTL
TXD[8:5]
TXD[7:4]
TXD[9]
TXERR
TXD[4]
TXEN
TXD[3:0]
(At Transmitter)
TXD[8:5][3:0]
TXD[7:4][3:0]
TX_CLK
(At PHY)
RX_CTL
RXD[8:5]
RXD[7:4]
RXD[9]
RXERR
RXD[4]
RXDV
RXD[3:0]
RXD[8:5][3:0]
RXD[7:4][3:0]
RX_CLK
(At PHY)
tSKRGT
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