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| 型号： | MPC8555VTAPFX |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 833 MHz, RISC PROCESSOR, PBGA783 |
| 封装： | 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783 |
| 文件页数： | 71/88页 |
| 文件大小： | 1244K |
| 代理商： | MPC8555VTAPFX |
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MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
73
Thermal
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
16.2.4
Heat Sink Selection Examples
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
16.2.4.1
Case 1
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
TJ = TI + TR + (θJC + θINT + θSA) × PD
where
TJ is the die-junction temperature
TI is the inlet cabinet ambient temperature
TR is the air temperature rise within the computer cabinet
θ
JC is the junction-to-case thermal resistance
θ
INT is the adhesive or interface material thermal resistance
θ
SA is the heat sink base-to-ambient thermal resistance
During operation the die-junction temperatures (TJ) should be maintained within the range specified in
Table 2. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (TA)
may range from 30
° to 40°C. The air temperature rise within a cabinet (T
R) may be in the range of 5° to
10
°C. The thermal resistance of some thermal interface material (θ
INT) may be about 1°C/W. For the
purposes of this example, the
θ
JC value given in Table 49 that includes the thermal grease interface and is
documented in note 4 is used. If a thermal pad is used,
θ
INT must be added.
Assuming a TI of 30C, a TR of 5C, a FC-PBGA package θJC = 0.96, and a power consumption (PD) of
8.0 W, the following expression for TJ is obtained:
Die-junction temperature: TJ = 30°C + 5°C + (0.96°C/W + θSA) × 8.0 W
The heat sink-to-ambient thermal resistance (
θ
SA) versus airflow velocity for a Thermalloy heat sink
#2328B is shown in Figure 46.
Assuming an air velocity of 2 m/s, we have an effective
θ
SA+ of about 3.3C/W, thus
TJ = 30C + 5C + (0.96C/W + 3.3C/W) × 8.0 W,
resulting in a die-junction temperature of approximately 69C which is well within the maximum
operating temperature of the component.
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