参数资料
型号: MPC8569EVTAUNLB
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: RISC PROCESSOR, PBGA783
封装: 29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783
文件页数: 79/126页
文件大小: 2847K
代理商: MPC8569EVTAUNLB
MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 0
Ethernet Interface
Freescale Semiconductor
56
2.6.3.1.2
GMII Receive AC Timing Specifications
The following table provides the GMII receive AC timing specifications.
The following figure provides the GMII AC test load.
Figure 13. GMII AC Test Load
The following figure shows the GMII receive AC timing diagram.
Figure 14. GMII Receive AC Timing Diagram
2.6.3.2
MII AC Timing Specifications
This section describes the MII transmit and receive AC timing specifications.
Table 26. GMII Receive AC Timing Specifications
For recommended operating conditions, see Table 3
Parameter
Symbol
Min
Typ
Max
Unit
Note
RX_CLK clock period
tGRX
7.5
ns
1
RX_CLK duty cycle
tGRXH/tGRX
35
65
%
2
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tGRDVKH
2.0
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tGRDXKH
0.2
ns
RX_CLK clock rise time (20%–80%)
tGRXR
——
1.0
ns
2
RX_CLK clock fall time (80%–20%)
tGRXF
——
1.0
ns
2
Note:
1. The frequency of RX_CLK should not exceed frequency of gigabit Ethernet reference clock by more than 300 ppm
2. System/board must be designed to ensure the input requirement to the device is achieved. Proper device operation is
guaranteed for inputs meeting this requirement by design, simulation, characterization, or functional testing
Output
Z0 = 50 Ω
LVDD/2
RL = 50 Ω
RX_CLK
RXD[7:0]
tGRDXKH
tGRX
tGRXH
tGRXR
tGRXF
tGRDVKH
RX_DV
RX_ER
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