参数资料
型号: MPC8569EVTAUNLB
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: RISC PROCESSOR, PBGA783
封装: 29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783
文件页数: 88/126页
文件大小: 2847K
代理商: MPC8569EVTAUNLB
MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 0
Ethernet Interface
Freescale Semiconductor
64
Duty cycle for Gigabit
tRGTH/tRGT
45
50
55
%
6
Rise time (20%–80%)
tRGTR
1.75
ns
6
Fall time (20%–80%)
tRGTF
1.75
ns
6
Notes:
1. In general, the clock reference symbol representation for this section is based on the symbols RGT to represent RGMII and
RTBI timing. For example, the subscript of tRGT represents the TBI (T) receive (RX) clock. Note also that the notation for rise
(R) and fall (F) times follows the clock symbol that is being represented. For symbols representing skews, the subscript is
skew (SK) followed by the clock that is being skewed (RGT).
2. This implies that PC board design will require clocks to be routed such that an additional trace delay of greater than 1.5 ns is
added to the associated clock signal. Many PHY vendors already incorporate the necessary delay inside their chip. If so,
additional PCB delay is probably not needed.
3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively.
4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as long
as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned
between.
5. The frequency of RX_CLK should not exceed the frequency of gigabit ethernet reference clock by more than 300 ppm.
6. System/board must be designed to ensure the input requirement to the device is achieved. Proper device operation is
guaranteed for inputs meeting this requirement by design, simulation, characterization, or functional testing.
Table 35. RGMII and RTBI AC Timing Specifications (continued)
For recommended operating conditions, see Table 3
Parameter
Symbol1
Min
Typ
Max
Unit
Notes
相关PDF资料
PDF描述
MPC8569ECVTANKGB RISC PROCESSOR, PBGA783
MPC8569ECVTANKG RISC PROCESSOR, PBGA783
MPC8569VTAUNLA RISC PROCESSOR, PBGA783
MPC8569EVTAUNL RISC PROCESSOR, PBGA783
MPC8569ECVTAQLJA RISC PROCESSOR, PBGA783
相关代理商/技术参数
参数描述
MPC8569VJAUNLB 制造商:Freescale Semiconductor 功能描述:IC MPU PWRQUICC 1333MHZ 783FCBGA
MPC8569VTANKGB 功能描述:数字信号处理器和控制器 - DSP, DSC 8569 ST 800/600/400 r2.1 RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MPC8569VTAQLJB 功能描述:数字信号处理器和控制器 - DSP, DSC 8569 ST 1067/667/533 r2.1 RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MPC8569VTAUNLB 功能描述:数字信号处理器和控制器 - DSP, DSC 8569 ST 1333/667/533 r2.1 RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MPC8572CLVTAULD 功能描述:微处理器 - MPU 1333 LOW PWR EXT TEMP RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324