参数资料
型号: MRF6V2150NBR5
厂商: Freescale Semiconductor
文件页数: 11/18页
文件大小: 1492K
描述: MOSFET RF N-CH 50V TO272-4
产品培训模块: RF Broadcast Solutions
标准包装: 1
晶体管类型: LDMOS
频率: 220MHz
增益: 25dB
电压 - 测试: 50V
额定电流: 2.5mA
电流 - 测试: 450mA
功率 - 输出: 150W
电压 - 额定: 110V
封装/外壳: TO-272BB
供应商设备封装: TO-272 WB-4
包装: 标准包装
其它名称: MRF6V2150NBR5DKR
2
RF Device Data
Freescale Semiconductor
MRF6V2150NR1 MRF6V2150NBR1
Table 4. Moisture Sensitivity Level
Test Methodology
Rating
Package Peak Temperature
Unit
Per JESD22--A113, IPC/JEDEC J--STD--020
3
260
°C
Table 5. Electrical Characteristics
(TA
=25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Off Characteristics
Zero Gate Voltage Drain Leakage Current
(VDS
= 100 Vdc, VGS
=0Vdc)
IDSS
?
?
2.5
mA
Zero Gate Voltage Drain Leakage Current
(VDS
=50Vdc,VGS
=0Vdc)
IDSS
?
?
50
μAdc
Drain--Source Breakdown Voltage
(ID
=75mA,VGS
=0Vdc)
V(BR)DSS
110
?
?
Vdc
Gate--Source Leakage Current
(VGS
=5Vdc,VDS
=0Vdc)
IGSS
?
?
10
μAdc
On Characteristics
Gate Threshold Voltage
(VDS
=10Vdc,ID
= 400
μAdc)
VGS(th)
1
1.62
3
Vdc
Gate Quiescent Voltage
(VDD
=50Vdc,ID
= 450 mAdc, Measured in Functional Test)
VGS(Q)
1.5
2.6
3.5
Vdc
Drain--Source On--Voltage
(VGS
=10Vdc,ID
=1Adc)
VDS(on)
?
0.26
?
Vdc
Dynamic Characteristics
Reverse Transfer Capacitance
(VDS
=50Vdc±
30 mV(rms)ac @ 1 MHz, VGS
=0Vdc)
Crss
?
1.6
?
pF
Output Capacitance
(VDS
=50Vdc±
30 mV(rms)ac @ 1 MHz, VGS
=0Vdc)
Coss
?
93
?
pF
Input Capacitance
(VDS
=50Vdc,VGS
=0Vdc±
30 mV(rms)ac @ 1 MHz)
Ciss
?
163
?
pF
Functional Tests
(In Freescale Test Fixture, 50 ohm system) VDD
=50Vdc,IDQ
= 450 mA, Pout
= 150 W, f = 220 MHz, CW
Power Gain
Gps
23.5
25
26.5
dB
Drain Efficiency
ηD
66
68.3
?
%
Input Return Loss
IRL
?
-- 1 7
-- 9
dB
Typical Performances
(In Freescale 27 MHz and 450 MHz Test Fixtures, 50 ohm system) VDD
=50Vdc,IDQ
= 450 mA, Pout
= 150 W CW
Power Gain f = 27 MHz
f = 450 MHz
Gps
?
?
32.3
22.9
?
?
dB
Drain Efficiency f = 27 MHz
f = 450 MHz
ηD
?
?
78.7
57.6
?
?
%
Input Return Loss f = 27 MHz
f = 450 MHz
IRL
?
?
--10.6
--17.6
?
?
dB
ATTENTION: The MRF6V2150N and MRF6V2150NB are high power devices and special considerations
must be followed in board design and mounting. Incorrect mounting can lead to internal temperatures which
exceed the maximum allowable operating junction temperature. Refer to Freescale Application Note AN3263
(for bolt down mounting) or AN1907 (for solder reflow mounting)
PRIOR TO STARTING SYSTEM DESIGN
to
ensure proper mounting of these devices.
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