参数资料
型号: MRF6V2150NBR5
厂商: Freescale Semiconductor
文件页数: 9/18页
文件大小: 1492K
描述: MOSFET RF N-CH 50V TO272-4
产品培训模块: RF Broadcast Solutions
标准包装: 1
晶体管类型: LDMOS
频率: 220MHz
增益: 25dB
电压 - 测试: 50V
额定电流: 2.5mA
电流 - 测试: 450mA
功率 - 输出: 150W
电压 - 额定: 110V
封装/外壳: TO-272BB
供应商设备封装: TO-272 WB-4
包装: 标准包装
其它名称: MRF6V2150NBR5DKR
MRF6V2150NR1 MRF6V2150NBR1
17
RF Device Data
Freescale Semiconductor
PRODUCT DOCUMENTATION AND SOFTWARE
Refer to the following documents to aid your design process.
Application Notes
?
AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages
?
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
?
AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages
Engineering Bulletins
?
EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
?
Electromigration MTTF Calculator
?
RF High Power Model
For Software, do a Part Number search at http://www.freescale.com, and select the ?Part Number? link. Go to the Software &
Tools tab on the part?s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
0
Feb. 2007
?
Initial Release of Data Sheet
1
May 2007
?
Corrected Test Circuit Component part numbers in Table 6, Component Designations and Values for C4,
C17, C5, C18, C9, C12, C14, C23, C13, C21, and C22, p. 3
2
Apr. 2008
?
Added Case Operating Temperature limit to the Maximum Ratings table and set limit to 150°C, p. 1
?
Corrected Ciss
test condition to indicate AC stimulus on the VGS
connection versus the VDS
connection,
Dynamic Characteristics table, p. 2
?
Updated PCB information to show more specific material details, Fig. 2, Test Circuit Schematic, p. 3
?
Updated Part Numbers in Table 6, Component Designations and Values, to latest RoHS compliant part
numbers, p. 3
?
Replaced Case Outline 1486--03, Issue C, with 1486--03, Issue D, p. 8--10. Added pin numbers 1 through 4
on Sheet 1.
?
Replaced Case Outline 1484--04, Issue D, with 1484--04, Issue E, p. 11--13. Added pin numbers 1 through
4 on Sheet 1, replacing Gate and Drain notations with Pin 1 and
Pin 2 designations.
3
Dec. 2008
?
Added Typical Performances table for 27 MHz, 450 MHz applications, p. 2
?
Added Figs. 15 and 16, Test Circuit Component Layout -- 27 MHz and 450 MHz, and Tables 7 and 8, Test
Circuit Component Designations and Values -- 27 MHz and 450 MHz, p. 8, 9
?
Added Fig. 17, Series Equivalent Source and Load Impedance for 27 MHz, 450 MHz, p. 10
4
Apr. 2010
?
Operating Junction Temperature increased from 200°C to 225°C in Maximum Ratings table, related
?Continuous use at maximum temperature will affect MTTF? footnote added and changed 200°C to 225°C
in Capable Plastic Package bullet, p. 1
?
Added Electromigration MTTF Calculator and RF High Power Model availability to Product Software,
p. 17
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