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| 型号： | MSC8122ADSE |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 43/48页 |
| 文件大小： | 0K |
| 描述： | KIT ADVANCED DEV SYSTEM 8122 |
| 标准包装： | 1 |
| 系列： | StarCore |
| 类型： | DSP |
| 适用于相关产品： | MSC8122 |
| 所含物品： | 板 |
| 相关产品： | MSC8122TVT6400-ND - DSP 16BIT 400MHZ MULTI 431FCPBGA MSC8122TMP6400V-ND - DSP 16BIT 400MHZ MULTI 431FCPBGA MSC8122TMP6400-ND - DSP 16BIT 400MHZ MULTI 431FCPBGA MSC8122TMP4800V-ND - DSP 16BIT 300MHZ MULTI 431FCPBGA MSC8122MP8000-ND - DSP 16BIT 500MHZ MULTI 431FCPBGA MSC8122VT8000-ND - IC DSP QUAD 16B 500MHZ 431FCPBGA MSC8122TVT6400V-ND - IC DSP QUAD 16B 400MHZ 431FCPBGA MSC8122TVT4800V-ND - IC DSP QUAD 16B 300MHZ 431FCPBGA |
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Ordering Information
3.5
Thermal Considerations
An estimation of the chip-junction temperature , T J , in ° C can be obtained from the following:
T J = T A + (R θ JA × P D )
Eqn. 1
where
T A = ambient temperature near the package ( ° C)
R θ JA = junction-to-ambient thermal resistance ( ° C/W)
P D = P INT + P I/O = power dissipation in the package (W)
P INT = I DD × V DD = internal power dissipation (W)
P I/O = power dissipated from device on output pins (W)
The power dissipation values for the MSC8122 are listed in Table 2-3 . The ambient temperature for the device is the air
temperature in the immediate vicinity that would cool the device. The junction-to-ambient thermal resistances are JEDEC
standard values that provide a quick and easy estimation of thermal performance. There are two values in common usage: the
value determined on a single layer board and the value obtained on a board with two planes. The value that more closely
approximates a specific application depends on the power dissipated by other components on the printed circuit board (PCB).
The value obtained using a single layer board is appropriate for tightly packed PCB configurations. The value obtained using a
board with internal planes is more appropriate for boards with low power dissipation (less than 0.02 W/cm 2 with natural
convection) and well separated components. Based on an estimation of junction temperature using this technique, determine
whether a more detailed thermal analysis is required. Standard thermal management techniques can be used to maintain the
device thermal junction temperature below its maximum. If T J appears to be too high, either lower the ambient temperature or
the power dissipation of the chip. You can verify the junction temperature by measuring the case temperature using a small
diameter thermocouple (40 gauge is recommended) or an infrared temperature sensor on a spot on the device case that is painted
black. The MSC8122 device case surface is too shiny (low emissivity) to yield an accurate infrared temperature measurement.
Use the following equation to determine T J :
where
T J = T T + ( θ JA × P D )
T T = thermocouple (or infrared) temperature on top of the package ( ° C)
θ JA = thermal characterization parameter ( ° C/W)
P D = power dissipation in the package (W)
Eqn. 2
Note:
4
See MSC8102, MSC8122, and MSC8126 Thermal Management Design Guidelines (AN2601/D).
Ordering Information
Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order.
Part
Package Type
Core
Voltage
Operating
Temperature
Core
Frequency
(MHz)
Order Number
Lead-Free Lead-Bearing
MSC8122
Flip Chip Plastic Ball Grid Array (FC-PBGA)
1.1 V
–40° to 105°C
300
MSC8122TVT4800V
MSC8122TMP4800V
400
MSC8122TVT6400V
MSC8122TMP6400V
1.2 V
–40° to 105°C
0° to 90°C
400
500
MSC8122TVT6400
MSC8122VT8000
MSC8122TMP6400
MSC8122MP8000
MSC8122 Quad Digital Signal Processor Data Sheet, Rev. 16
Freescale Semiconductor
43
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MSC8122MP8000 | 功能描述:DSP 16BIT 500MHZ MULTI 431FCPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:StarCore 标准包装:40 系列:TMS320DM64x, DaVinci™ 类型:定点 接口:I²C，McASP，McBSP 时钟速率:400MHz 非易失内存:外部 芯片上RAM:160kB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:0°C ~ 90°C 安装类型:表面贴装 封装/外壳:548-BBGA，FCBGA 供应商设备封装:548-FCBGA（27x27） 包装:托盘 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
| MSC8122TMP4800V | 功能描述:DSP 16BIT 300MHZ MULTI 431FCPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:StarCore 标准包装:40 系列:TMS320DM64x, DaVinci™ 类型:定点 接口:I²C，McASP，McBSP 时钟速率:400MHz 非易失内存:外部 芯片上RAM:160kB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:0°C ~ 90°C 安装类型:表面贴装 封装/外壳:548-BBGA，FCBGA 供应商设备封装:548-FCBGA（27x27） 包装:托盘 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
| MSC8122TMP6400 | 功能描述:数字信号处理器和控制器 - DSP, DSC PBGA PB 1.2V 105C 400MHZ RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT |
| MSC8122TMP6400V | 功能描述:DSP 16BIT 400MHZ MULTI 431FCPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:StarCore 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI，以太网，RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA，FCBGA 供应商设备封装:431-FCPBGA（20x20） 包装:托盘 |
| MSC8122TVT4800V | 功能描述:IC DSP QUAD 16B 300MHZ 431FCPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:StarCore 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI，以太网，RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA，FCBGA 供应商设备封装:431-FCPBGA（20x20） 包装:托盘 |
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