参数资料
型号: MT46V4M16
厂商: Micron Technology, Inc.
英文描述: 1 Meg x 16 x 4 banks DDR SDRAM(1M x 16 x 4组,双数据速率同步动态RAM)
中文描述: 1梅格× 16 × 4银行DDR SDRAM内存(100万× 16 × 4组,双数据速率同步动态RAM)的
文件页数: 48/69页
文件大小: 2369K
代理商: MT46V4M16
48
64Mb: x4, x8, x16 DDR SDRAM
64Mx4x8x16DDR_B.p65
Rev. B; Pub. 10/00
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2000, Micron Technology, Inc.
64Mb: x4, x8, x16
DDR SDRAM
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS
(Notes: 1
5, 14-17, 33; notes appear on pages 48
51) (0
°
C
T
A
+70
°
C; V
DD
Q = +2.5V ±0.2V, V
DD
= +2.5V ±0.2V)
AC CHARACTERISTICS
PARAMETER
SYMBOL
Access window of DQs from CK/CK#
CK high-level width
CK low-level width
Clock cycle time
CL = 2.5
CL = 2
DQ and DM input hold time relative to DQS
DQ and DM input setup time relative to DQS
DQ and DM input pulse width (for each input)
Access window of DQS from CK/CK#
DQS input high pulse width
DQS input low pulse width
DQS-DQ skew, DQS to last DQ valid, per group, per access
DQS-DQ skew, first DQS to last DQ valid, per access
Write command to first DQS latching transition
DQS falling edge to CK rising - setup time
DQS falling edge from CK rising - hold time
Half clock period
Data-out high-impedance window from CK/CK#
Data-out low-impedance window from CK/CK#
Address and control input hold time (fast slew rate)
Address and control input setup time (fast slew rate)
Address and control input hold time (slow slew rate)
Address and control input setup time (slow slew rate)
LOAD MODE REGISTER command cycle time
DQ-DQS hold, DQS to first DQ to go non-valid, per access
-7
-75
-8
MIN
-0.75
0.45
0.45
7
7.5
0.5
0.5
1.75
-0.75
0.35
0.35
MAX
+0.75
0.55
0.55
12
12
MIN
-0.75
0.45
0.45
7.5
10
0.5
0.5
1.75
-0.75
0.35
0.35
MAX
+0.75
0.55
0.55
12
12
MIN
-0.8
0.45
0.45
8
10
0.6
0.6
2
-0.8
0.35
0.35
MAX
+0.8
0.55
0.55
12
12
UNITS
ns
t
CK
t
CK
ns
ns
ns
ns
ns
ns
t
CK
t
CK
ns
ns
t
CK
t
CK
t
CK
ns
ns
ns
ns
ns
ns
ns
ns
ns
NOTES
t
AC
t
CH
t
CL
30
30
52
52
t
CK (2.5)
t
CK (2)
t
DH
t
DS
t
DIPW
t
DQSCK
t
DQSH
t
DQSL
t
DQSQ
t
DQSQA
t
DQSS
t
DSS
t
DSH
t
HP
t
HZ
t
LZ
t
IH
F
t
IS
F
t
IH
S
t
IH
S
t
MRD
t
QH
26, 31
26, 31
31
+0.75
+0.75
+0.8
0.5
0.7
1.25
0.5
0.7
1.25
0.6
0.8
1.25
25, 26
36
0.75
0.2
0.2
t
CH,
t
CL
-0.75
-0.75
.90
.90
1
1
15
t
HP
-
t
QHS
0.75
0.2
0.2
t
CH,
t
CL
-0.75
-0.75
.90
.90
1
1
15
t
HP
-
t
QHS
0.75
0.2
0.2
t
CH,
t
CL
-0.8
-0.8
1.1
1.1
1.1
1.1
16
t
HP
-
t
QHS
34
18
18
14
14
14
14
+0.75
+0.75
+0.75
+0.75
+0.8
+0.8
25, 26
Data hold skew factor
ACTIVE to PRECHARGE command
ACTIVE to READ with Auto precharge command
ACTIVE to ACTIVE/AUTO REFRESH command period
AUTO REFRESH command period
REFRESH to REFRESH command interval`
Average periodic refresh interval
ACTIVE to READ or WRITE delay
PRECHARGE command period
DQS Read preamble
DQS Read postamble
ACTIVE bank
a
to ACTIVE bank
b
command
Terminating voltage delay to V
DD
DQS Write preamble
DQS Write preamble setup time
DQS Write postamble
Write recovery time
Internal WRITE to READ command delay
Exit SELF REFRESH to non-READ command
Exit SELF REFRESH to READ command
Data valid output window (DVW)
t
QHS
t
RAS
t
RAP
t
RC
t
RFC
t
REFC
t
REFI
t
RCD
t
RP
t
RPRE
t
RPST
t
RRD
t
VTD
t
WPRE
t
WPRES
t
WPST
t
WR
t
WTR
t
XSNR
t
XSRD
na
0.75
120,000
t
RAS (MIN) - (burst length
*
t
CK/2)
65
75
140.6
15.6
20
20
1.1
0.9
0.6
0.4
15
0
0.25
0.25
0
0
0.4
0.6
0.4
15
15
1
1
75
75
200
200
t
QH -
t
DQSQ
t
QH -
t
DQSQ
0.75
120,000
1
ns
ns
ns
ns
ns
μs
μs
ns
ns
t
CK
t
CK
t
CK
ns
t
CK
ns
t
CK
ns
t
CK
ns
t
CK
ns
45
45
50
120,000
35
46
60
67
70
80
50
23
23
140.6
15.6
140.6
15.6
15
15
0.9
0.4
15
0
20
20
0.9
0.4
15
0
0.25
0
0.4
15
1
80
200
t
QH -
t
DQSQ
1.1
0.6
1.1
0.6
42
20, 21
19
0.6
0.6
25
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