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| 型号： | NCL30105GEVB |
| 厂商： | ON Semiconductor |
| 文件页数： | 4/22页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL 80V 350 FOR LED DRV |
| 设计资源： | NCL30105GEVB Gerber Files NCL30105GEVB BOM NCL30105GEVB Schematic |
| 标准包装： | 1 |
| 电流 - 输出 / 通道： | 350mA |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 60V |
| 已供物品： | 板 |
| 已用 IC / 零件： | NCL30105 |
| 其它名称： | NCL30105GEVBOS |
NCL30105
Table 2. MAXIMUM RATINGS TABLE (Notes 1 – 4)
Rating
toff Voltage
toff Current
DIM Voltage
DIM Current
SSTART Voltage
SSTART Current
CS Voltage
CS Current
DRV Voltage
DRV Sink Current
DRV Source Current
Supply Voltage
Supply Current
Power Dissipation (SO ? 8)
(T A = 70 ° C, 2.0 Oz Cu, 55 mm 2 Printed Circuit Copper Clad)
Thermal Resistance Junction ? to ? Ambient (SO ? 8)
(2.0 Oz Cu, 55 mm 2 Printed Circuit Copper Clad)
Junction ? to ? Air, Low conductivity PCB (Note 3)
Junction ? to ? Air, High conductivity PCB (Note 4)
Operating Junction Temperature Range
Storage Temperature Range
Lead Temperature (Soldering, 10 s)
Symbol
V toff
I toff
V DIM
I DIM
V SSTART
I SSTART
V CS
I CS
V DRV
I DRV(sink)
I DRV(source)
V CC
I CC
P D
R q JA
T J
T STG
T L
Value
? 0.3 to 5.5
± 10
? 0.3 to 7
± 10
? 0.3 to 5.5
± 10
? 0.3 to 7
± 10
? 0.3 to V CC
500
250
? 0.3 to 22
± 20
450
178
168
127
? 40 to 150
? 60 to 150
300
Unit
V
mA
V
mA
V
mA
V
mA
V
mA
mA
V
mA
mW
° C/W
° C
° C
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Pins 1 ? 8: Human Body Model 2000 V per JEDEC Standard JESD22 ? A114E.
Pins 1 ? 8: Machine Model Method 200 V per JEDEC Standard JESD22 ? A115 ? A.
Pins 1 ? 8: Charged Device Model 2000 V per JEDEC Standard JESD22 ? C101C.
2. This device contains Latch ? Up protection and exceeds ± 100 mA per JEDEC Standard JESD78.
3. As mounted on a 40x40x1.5 mm FR4 substrate with a single layer of 80 mm 2 of 2 oz copper traces and heat spreading area. As specified
for a JEDEC 51 low conductivity test PCB. Test conditions were under natural convection or zero air flow.
4. As mounted on a 40x40x1.5 mm FR4 substrate with a single layer of 650 mm 2 of 2 oz copper traces and heat spreading area. As specified
for a JEDEC 51 high conductivity test PCB. Test conditions were under natural convection or zero air flow.
http://onsemi.com
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