参数资料
型号: NTF3055-160T1
厂商: ON Semiconductor
文件页数: 2/8页
文件大小: 0K
描述: MOSFET N-CH 60V 2A SOT223
产品变化通告: Product Obsolescence 30/Dec/2003
标准包装: 1,000
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 2A
开态Rds(最大)@ Id, Vgs @ 25° C: 160 毫欧 @ 1A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 14nC @ 10V
输入电容 (Ciss) @ Vds: 280pF @ 25V
功率 - 最大: 1.3W
安装类型: 表面贴装
封装/外壳: TO-261-4,TO-261AA
供应商设备封装: SOT-223
包装: 带卷 (TR)
其它名称: NTF3055-160T1OS
NTF3055–160
ELECTRICAL CHARACTERISTICS (TA = 25 ° C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain–to–Source Breakdown Voltage (Note 3.)
(VGS = 0 Vdc, ID = 250 μ Adc)
Temperature Coefficient (Positive)
V(BR)DSS
60
72
72
Vdc
mV/ ° C
Zero Gate Voltage Drain Current
IDSS
μ Adc
(VDS = 60 Vdc, VGS = 0 Vdc)
(VDS = 60 Vdc, VGS = 0 Vdc, TJ = 150 ° C)
1.0
10
Gate–Body Leakage Current
(VGS = ± 20 Vdc, VDS = 0 Vdc)
IGSS
± 100
nAdc
ON CHARACTERISTICS (Note 3.)
Gate Threshold Voltage (Note 3.)
(VDS = VGS, ID = 250 μ Adc)
Threshold Temperature Coefficient (Negative)
VGS(th)
2.0
3.1
6.6
4.0
Vdc
mV/ ° C
Static Drain–to–Source On–Resistance (Note 3.)
RDS(on)
m ?
(VGS = 10 Vdc, ID = 1.0 Adc)
Static Drain–to–Source On–Resistance (Note 3.)
(VGS = 10 Vdc, ID = 2.0 Adc)
(VGS = 10 Vdc, ID = 1.0 Adc, TJ = 150 ° C)
VDS(on)
142
0.142
0.270
160
0.384
Vdc
Forward Transconductance (Note 3.)
(VDS = 8.0 Vdc, ID = 1.5 Adc)
gfs
1.8
Mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
Ciss
200
280
pF
(V DS = 25 Vdc, VGS = 0 V,
Output Capacitance
Transfer Capacitance
Vd V
f = 1.0 MHz)
Coss
Crss
68
26
100
40
SWITCHING CHARACTERISTIC S (Note 4.)
Turn–On Delay Time
td(on)
9.2
20
ns
VGS = 10 Vdc,
Rise Time
Turn–Off Delay Time
Fall Time
(VDD = 30 Vdc, ID = 2.0 Adc,
Vdc
RG = 9.1 ? ) (Note 3.)
tr
td(off)
tf
9.2
16
9.2
20
40
20
(V DS = 48 Vdc, ID = 2.0 0 Adc,
Gate Charge
Vd 2 Ad
V GS = 10 Vdc) (Note 3.)
QT
Q1
Q2
6.9
1.4
3.0
14
nC
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage
(IS = 2.0 Adc, VGS = 0 Vdc)
VSD
Vdc
(IS = 2.0 Adc, VGS = 0 Vdc,
TJ = 150 ° C) (Note 3.)
0.86
0.70
1.0
Reverse Recovery Time
Reverse Recovery Stored Charge
(IS = 2.0 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/ μ s) (Note 3.)
trr
ta
tb
QRR
28.9
19.1
9.8
0.030
ns
μ C
3. Pulse Test: Pulse Width ≤ 300 μ s, Duty Cycle ≤ 2.0%.
4. Switching characteristics are independent of operating junction temperatures.
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