参数资料
型号: NTGS3443T1
厂商: ON Semiconductor
文件页数: 6/6页
文件大小: 0K
描述: MOSFET P-CH 20V 2.2A 6-TSOP
产品变化通告: Wire Change 08/Oct/2008
Product Discontinuation 20/Aug/2008
标准包装: 3,000
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 2.2A
开态Rds(最大)@ Id, Vgs @ 25° C: 65 毫欧 @ 4.4A,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 15nC @ 4.5V
输入电容 (Ciss) @ Vds: 565pF @ 5V
功率 - 最大: 500mW
安装类型: 表面贴装
封装/外壳: SC-74,SOT-457
供应商设备封装: 6-TSOP
包装: 带卷 (TR)
其它名称: NTGS3443T1OS
NTGS3443, NVGS3443
PACKAGE DIMENSIONS
TSOP ? 6
CASE 318G ? 02
ISSUE V
C
STYLE 1:
PIN 1. DRAIN
2. DRAIN
E1
NOTE 5
0.05
A1
e
6
1
5
2
D
4
3
E
b
A
c
H
L
M
DETAIL Z
DETAIL Z
L2
GAUGE
PLANE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
MILLIMETERS
DIM MIN NOM MAX
A 0.90 1.00 1.10
A1 0.01 0.06 0.10
b 0.25 0.38 0.50
c 0.10 0.18 0.26
D 2.90 3.00 3.10
E 2.50 2.75 3.00
E1 1.30 1.50 1.70
e 0.85 0.95 1.05 3. GATE
L 0.20 0.40 0.60 4. SOURCE
L2 0.25 BSC 5. DRAIN
M 0 ° ? 1 0 ° 6. DRAIN
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
3.20
6X
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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NTGS3443T1/D
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