参数资料
型号: NTGS4141NT1G
厂商: ON Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: MOSFET N-CH 30V 3.5A 6-TSOP
产品目录绘图: MOSFET 6-TSOP
标准包装: 10
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 3.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 25 毫欧 @ 7A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 12nC @ 10V
输入电容 (Ciss) @ Vds: 560pF @ 24V
功率 - 最大: 500mW
安装类型: 表面贴装
封装/外壳: SC-74,SOT-457
供应商设备封装: 6-TSOP
包装: 标准包装
产品目录页面: 1558 (CN2011-ZH PDF)
其它名称: NTGS4141NT1GOSDKR
NTGS4141N
Power MOSFET
30 V, 7.0 A, Single N ? Channel, TSOP ? 6
Features
? Low R DS(on)
? Low Gate Charge
? Pb ? Free Package is Available
http://onsemi.com
Applications
? Load Switch
? Notebook PC
? Desktop PC
V (BR)DSS
30 V
R DS(on) TYP
21.5 m W @ 10 V
30 m W @ 4.5 V
I D MAX
7.0 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Rating Symbol
Drain ? to ? Source Voltage V DSS
Value
30
Unit
V
N ? Channel
Drain 1 2 5 6
Gate ? to ? Source Voltage
V GS
± 20
V
Continuous Drain
Current (Note 1)
Steady
State
T A = 25 ° C
T A = 85 ° C
I D
5.0
3.6
A
Gate 3
t ≤ 10 s
T A = 25 ° C
7.0
Power Dissipation
(Note 1)
Steady
State
T A = 25 ° C
P D
1.0
W
Source 4
1
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Pulsed Drain Current
t ≤ 10 s
Steady T A = 25 ° C
State
T A = 85 ° C
T A = 25 ° C
t p = 10 m s, V GS =10V
I D
P D
I DM
2.0
3.5
2.5
0.5
45
A
W
A
TSOP ? 6
CASE 318G
STYLE 1
S4 = Device Code
MARKING
DIAGRAM
S4 M G
G
Pulsed Drain Current t p = 30 m s, V GS =5V
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche Energy
(V DD = 30 V, I L = 10.4 A, V GS = 10 V,
L = 1.0 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
I D
T J ,
T STG
I S
EAS
T L
30
? 55 to
150
2.0
54
260
A
° C
A
mJ
° C
M = Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
Drain Drain Source
6 5 4
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE RATINGS
1 2 3
Drain Drain Gate
Rating
Symbol
Max
Unit
ORDERING INFORMATION
Junction ? to ? Ambient – Steady State (Note 1)
Junction ? to ? Ambient – t ≤ 10 s (Note 1)
R θ JA
R θ JA
125
62.5
° C/W
Device
NTGS4141NT1
Package
TSOP ? 6
Shipping ?
3000/Tape & Reel
3000/Tape & Reel
NTGS4141NT1G
Junction ? to ? Ambient – Steady State (Note 2) R θ JA 248
1. Surface ? mounted on FR4 board using 1 inch sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface ? mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.0773 in sq).
TSOP ? 6
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
April, 2012 ? Rev. 5
1
Publication Order Number:
NTGS4141N/D
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