参数资料
型号: NTJS3157NT4G
厂商: ON Semiconductor
文件页数: 6/6页
文件大小: 0K
描述: MOSFET N-CH 20V 3.2A SOT-363
产品变化通告: Product Discontinuation 04/April/2008
标准包装: 10,000
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 3.2A
开态Rds(最大)@ Id, Vgs @ 25° C: 60 毫欧 @ 4A,4.5V
Id 时的 Vgs(th)(最大): 400mV @ 250µA
闸电荷(Qg) @ Vgs: 15nC @ 4.5V
输入电容 (Ciss) @ Vds: 500pF @ 10V
功率 - 最大: 1W
安装类型: 表面贴装
封装/外壳: 6-TSSOP,SC-88,SOT-363
供应商设备封装: SOT-363
包装: 带卷 (TR)
NTJS3157N
PACKAGE DIMENSIONS
SC ? 88/SC70 ? 6/SOT ? 363
CASE 419B ? 02
ISSUE Y
2X
aaa H D
2X
bbb H D
E
e
A
6
1
D
5
2
4
3
D
L2
E1
aaa C
2X 3 TIPS
H
L
DETAIL A
GAGE
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-
SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-
TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
MILLIMETERS INCHES
c
END VIEW
6X
ccc C
B
TOP VIEW
SIDE VIEW
A1
6X
b
ddd
A2
A
C
M
C A-B D
DETAIL A
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
6X 6X
0.30 0.66
DIM
A
A1
A2
b
C
D
E
E1
e
L
L2
aaa
bbb
ccc
ddd
MIN NOM MAX
??? ??? 1.10
0.00 ??? 0.10
0.70 0.90 1.00
0.15 0.20 0.25
0.08 0.15 0.22
1.80 2.00 2.20
2.00 2.10 2.20
1.15 1.25 1.35
0.65 BSC
0.26 0.36 0.46
0.15 BSC
0.15
0.30
0.10
0.10
STYLE 28:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
MIN NOM MAX
??? ??? 0.043
0.000 ??? 0.004
0.027 0.035 0.039
0.006 0.008 0.010
0.003 0.006 0.009
0.070 0.078 0.086
0.078 0.082 0.086
0.045 0.049 0.053
0.026 BSC
0.010 0.014 0.018
0.006 BSC
0.006
0.012
0.004
0.004
2.50
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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For additional information, please contact your local
Sales Representative
NTJS3157N/D
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