参数资料
型号: NTLJF4156NT1G
厂商: ON Semiconductor
文件页数: 2/8页
文件大小: 0K
描述: MOSFET N-CH 30V 2.5A 6-WDFN
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 二极管(隔离式)
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 2.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 70 毫欧 @ 2A,4.5V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 6.5nC @ 4.5V
输入电容 (Ciss) @ Vds: 427pF @ 15V
功率 - 最大: 710mW
安装类型: 表面贴装
封装/外壳: 6-WDFN 裸露焊盘
供应商设备封装: 6-WDFN(2x2)
包装: 剪切带 (CT)
其它名称: NTLJF4156NT1GOSCT
NTLJF4156N
SCHOTTKY DIODE MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Peak Repetitive Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
Parameter
Symbol
V RRM
V R
I F
Value
30
30
2.0
Unit
V
V
A
THERMAL RESISTANCE RATINGS
Parameter
Junction?to?Ambient – Steady State (Note 3)
Junction?to?Ambient – t ≤ 5 s (Note 3)
Junction?to?Ambient – Steady State Min Pad (Note 4)
Symbol
R q JA
R q JA
R q JA
Max
83
54
180
Unit
° C/W
3. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces).
4. Surface Mounted on FR4 Board using the minimum recommended pad size of 30 mm 2 , 2 oz. Cu.
MOSFET ELECTRICAL CHARACTERISTICS (T J = 25 ° C unless otherwise noted)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain?to?Source Breakdown Voltage
Drain?to?Source Breakdown Voltage
Temperature Coefficient
V (BR)DSS
V (BR)DSS /T J
V GS = 0 V, I D = 250 m A
I D = 250 m A, Ref to 25 ° C
30
18.1
V
mV/ ° C
Zero Gate Voltage Drain Current
I DSS
V DS = 24 V, V GS = 0 V
T J = 25 ° C
T J = 85 ° C
1.0
10
m A
Gate?to?Source Leakage Current
I GSS
V DS = 0 V, V GS = ± 8.0 V
100
nA
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
V GS(TH)
V GS = V DS , I D = 250 m A
0.4
0.7
1.0
V
Gate Threshold
V GS(TH) /T J
2.8
mV/ ° C
Temperature Coefficient
Drain?to?Source On?Resistance
R DS(on)
V GS = 4.5, I D = 2.0 A
47
70
m W
V GS = 2.5, I D = 2.0 A
V GS = 1.8, I D = 1.8 A
V GS = 1.5, I D = 1.5 A
56
88
133
90
125
250
Forward Transconductance
g FS
V DS = 10 V, I D = 2.0 A
4.5
S
CHARGES, CAPACITANCES AND GATE RESISTANCE
Input Capacitance
C ISS
427
pF
Output Capacitance
Reverse Transfer Capacitance
C OSS
C RSS
V GS = 0 V, f = 1.0 MHz,
V DS = 15 V
51
32
Total Gate Charge
Threshold Gate Charge
Gate?to?Source Charge
Gate?to?Drain Charge
Gate Resistance
Q G(TOT)
Q G(TH)
Q GS
Q GD
R G
V GS = 4.5 V, V DS = 15 V,
I D = 2.0 A
5.4
0.5
0.8
1.24
3.7
6.5
nC
W
5. Pulse Test: Pulse Width v 300 m s, Duty Cycle v 2%.
6. Switching characteristics are independent of operating junction temperatures.
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