参数资料
型号: NTMFS4854NST1G
厂商: ON Semiconductor
文件页数: 1/7页
文件大小: 0K
描述: MOSFET N-CH 25V 15.2A SO-8FL
标准包装: 1,500
系列: SENSEFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 25V
电流 - 连续漏极(Id) @ 25° C: 15.2A
开态Rds(最大)@ Id, Vgs @ 25° C: 2.5 毫欧 @ 15A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 85nC @ 11.5V
输入电容 (Ciss) @ Vds: 4830pF @ 12V
功率 - 最大: 900mW
安装类型: 表面贴装
封装/外壳: 8-PowerTDFN
供应商设备封装: SO-8FL
包装: 带卷 (TR)
NTMFS4854NS
SENSEFET ? Power MOSFET
25 V, 149 A, Single N ? Channel, SO ? 8 FL
Features
? Accurate, Lossless Current Sensing
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
? CPU Power Delivery
? DC ? DC Converters
? Low Side Switching
V (BR)DSS
25 V
http://onsemi.com
R DS(ON) MAX
2.5 m W @ 10 V
3.9 m W @ 4.5 V
DRAIN
I D MAX
149 A
119 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter Symbol Value
Unit
GATE
Kelvin
Drain ? to ? Source Voltage
V DSS
25
V
SENSE SOURCE
4854NS
S
SENSE
SO ? 8 FLAT LEAD S
KELVIN
G
K1
Gate ? to ? Source Voltage
Continuous Drain
Current R q JA
(Note 1)
Power Dissipation
R q JA (Note 1)
Continuous Drain
Current R q JA
(Note 2) Steady
State
Power Dissipation
R q JA (Note 2)
Continuous Drain
Current R q JC
(Note 1)
Power Dissipation
R q JC (Note 1)
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T C = 25 ° C
T C = 85 ° C
T C = 25 ° C
V GS
I D
P D
ID
P D
I D
P D
± 16
24.4
17.6
2.31
15.2
11
0.9
149
107.5
86.2
V
A
W
A
W
A
W
MARKING
DIAGRAM
D (Do Not Connect)
S NC
1
AYWZZ
CASE 506BQ
D (Do Not Connect)
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
ORDERING INFORMATION
Pulsed Drain T A = 25 ° C,
Current t p = 10 m s
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Drain to Source DV/DT
I DM
T J , T STG
I S
dV/dt
298
? 55 to
+150
71
6
A
° C
A
V/ns
Device
NTMFS4854NST1G
NTMFS4854NST3G
Package
SO ? 8 FL
(Pb ? Free)
SO ? 8 FL
(Pb ? Free)
Shipping ?
1500 Tape / Reel
5000 Tape / Reel
Single Pulse Drain ? to ? Source Avalanche
Energy (T J = 25 ° C, V DD = 30 V, V GS = 10 V,
I L = 20 A pk , L = 1.0 mH, R G = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
EAS
T L
200
260
mJ
° C
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 1 sq ? in pad, 1 oz Cu.
2. Surface ? mounted on FR4 board using the minimum recommended pad size.
? Semiconductor Components Industries, LLC, 2012
May, 2012 ? Rev. 1
1
Publication Order Number:
NTMFS4854NS/D
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