参数资料
型号: NTMSD3P102R2
厂商: ON Semiconductor
文件页数: 3/9页
文件大小: 0K
描述: MOSFET P-CH 20V 2.34A 8-SOIC
产品变化通告: Wire Change 12/May/2009
Product Obsolescence 06/Oct/2006
标准包装: 2,500
系列: FETKY™
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 二极管(隔离式)
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 2.34A
开态Rds(最大)@ Id, Vgs @ 25° C: 85 毫欧 @ 3.05A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 25nC @ 10V
输入电容 (Ciss) @ Vds: 750pF @ 16V
功率 - 最大: 730mW
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
其它名称: NTMSD3P102R2OS
NTMSD3P102R2
MOSFET ELECTRICAL CHARACTERISTICS (T J = 25 ° C unless otherwise noted) (Note 9)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain-to-Source Breakdown Voltage
(V GS = 0 Vdc, I D = -250 m Adc)
Temperature Coefficient (Positive)
Zero Gate Voltage Drain Current
(V DS = -20 Vdc, V GS = 0 Vdc, T J = 25 ° C)
(V DS = -20 Vdc, V GS = 0 Vdc, T J = 125 ° C)
V (BR)DSS
I DSS
-20
-
-
-
-
-30
-
-
-
-
-1.0
-25
Vdc
mV/ ° C
m Adc
Gate-Body Leakage Current
I GSS
nAdc
(V GS = -20 Vdc, V DS = 0 Vdc)
Gate-Body Leakage Current
(V GS = +20 Vdc, V DS = 0 Vdc)
I GSS
-
-
-
-
-100
100
nAdc
ON CHARACTERISTICS
Gate Threshold Voltage
(V DS = V GS , I D = -250 m Adc)
Temperature Coefficient (Negative)
V GS(th)
-1.0
-
-1.7
3.6
-2.5
-
Vdc
Static Drain-to-Source On-State Resistance
R DS(on)
W
(V GS = -10 Vdc, I D = -3.05 Adc)
(V GS = -4.5 Vdc, I D = -1.5 Adc)
Forward Transconductance
(V DS = -15 Vdc, I D = -3.05 Adc)
g FS
-
-
-
0.063
0.090
5.0
0.085
0.125
-
Mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
C iss
-
518
750
pF
Output Capacitance
Reverse Transfer Capacitance
(V DS = -16 Vdc, V GS = 0 Vdc,
f = 1.0 MHz)
C oss
C rss
-
-
190
70
350
135
SWITCHING CHARACTERISTICS (Notes 10 & 11)
Turn-On Delay Time
t d(on)
-
12
22
ns
Rise Time
Turn-Off Delay Time
Fall Time
(V DD = -20 Vdc, I D = -3.05 Adc,
V GS = -10 Vdc,
R G = 6.0 W )
t r
t d(off)
t f
-
-
-
16
45
45
30
80
80
Turn-On Delay Time
t d(on)
-
16
-
ns
Rise Time
Turn-Off Delay Time
Fall Time
(V DD = -20 Vdc, I D = -1.5 Adc,
V GS = -4.5 Vdc,
R G = 6.0 W )
t r
t d(off)
t f
-
-
-
42
32
35
-
-
-
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
(V DS = -20 Vdc,
V GS = -10 Vdc,
I D = -3.05 Adc)
Q tot
Q gs
Q gd
-
-
-
16
2.0
4.5
25
-
-
nC
BODY-DRAIN DIODE RATINGS (Note 10)
Diode Forward On-Voltage
Reverse Recovery Time
(I S = -3.05 Adc, V GS = 0 Vdc)
(I S = -3.05 Adc, V GS = 0 Vdc, T J = 125 ° C)
(I S = -3.05 Adc, V GS = 0 Vdc,
dI S /dt = 100 A/ m s)
V SD
t rr
t a
-
-
-
-
-0.96
-0.78
34
18
-1.25
-
-
-
Vdc
ns
t b
-
16
-
Reverse Recovery Stored Charge
Q RR
-
0.03
-
m C
9. Handling precautions to protect against electrostatic discharge are mandatory.
10. Indicates Pulse Test: Pulse Width = 300 m s max, Duty Cycle = 2%.
11. Switching characteristics are independent of operating junction temperature.
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