参数资料
型号: NTZD3155CT2G
厂商: ON Semiconductor
文件页数: 8/8页
文件大小: 0K
描述: MOSFET N/P-CH COMPL 20V SOT-563
标准包装: 4,000
FET 型: N 和 P 沟道
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 540mA,430mA
开态Rds(最大)@ Id, Vgs @ 25° C: 550 毫欧 @ 540mA,4.5V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 2.5nC @ 4.5V
输入电容 (Ciss) @ Vds: 150pF @ 16V
功率 - 最大: 250mW
安装类型: 表面贴装
封装/外壳: SOT-563,SOT-666
供应商设备封装: SOT-563
包装: 带卷 (TR)
NTZD3155C
PACKAGE DIMENSIONS
SOT ? 563, 6 LEAD
CASE 463A
ISSUE F
D
? X ?
A
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
6
1
e
5
2
4
3
E
? Y ?
b 65 PL
0.08 (0.003)
M
X Y
H E
C
DIM
A
b
C
D
E
e
L
H E
MILLIMETERS
MIN NOM MAX
0.50 0.55 0.60
0.17 0.22 0.27
0.08 0.12 0.18
1.50 1.60 1.70
1.10 1.20 1.30
0.5 BSC
0.10 0.20 0.30
1.50 1.60 1.70
INCHES
MIN NOM MAX
0.020 0.021 0.023
0.007 0.009 0.011
0.003 0.005 0.007
0.059 0.062 0.066
0.043 0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
1.35
0.0531
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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NTZD3155C/D
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