参数资料
| 型号： | NUP1301,215 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 8/13页 |
| 文件大小： | 0K |
| 描述： | IC DIODE ARRAY ESD SOT23-3 |
| 标准包装： | 1 |
| 电压 - 反向隔离（标准值）： | 80V |
| 电压 - 击穿： | 100V |
| 功率（瓦特）： | 220W |
| 电极标记： | 2 通道阵列 - 单向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-236-3，SC-59，SOT-23-3 |
| 供应商设备封装： | SOT-23-3 |
| 包装： | 标准包装 |
| 其它名称： | 568-6351-6 |
NXP Semiconductors
NUP1301
Ultra low capacitance ESD protection array
8. Application information
Protection of a single (high-speed) data line in rail-to-rail con?guration. The protected data
line is connected to pin 3. Pin 1 is connected to ground (GND) and pin 2 is connected to
the supply rail (supply voltage V CC .) When the transient voltage exceeds the forward
voltage drop of one diode, the transient is directed either to the supply rail or to GND.
The advantages of these solutions are: low line capacitance (0.6 pF typically), fast
response time, and low clamping voltage.
V CC
V CC
D1
NUP1301
Audio
interface
D2
NUP1301
006aab568
Fig 8.
Typical application for the protection of one signal line
Circuit board layout and protection device placement:
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the NUP1301 as close to the input terminal or connector as possible.
2. The path length between the NUP1301 and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
9. Test information
9.1 Quality information
This product has been quali?ed in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test quali?cation for discrete semiconductors, and is
suitable for use in automotive applications.
NUP1301_1
? NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 11 May 2009
8 of 13
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相关代理商/技术参数 |
参数描述 |
|---|---|
| NUP1301ML3T1 | 功能描述:整流器 Low Cap. Diode Array RoHS:否 制造商:Vishay Semiconductors 产品:Standard Recovery Rectifiers 配置: 反向电压:100 V 正向电压下降: 恢复时间:1.2 us 正向连续电流:2 A 最大浪涌电流:35 A 反向电流 IR:5 uA 安装风格:SMD/SMT 封装 / 箱体:DO-221AC 封装:Reel |
| NUP1301ML3T1-D | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Low Capacitance Diode Array for ESD Protection in a Single Data Line |
| NUP1301ML3T1G | 功能描述:整流器 Low Cap. Diode Array For SNGL Line w/ESD RoHS:否 制造商:Vishay Semiconductors 产品:Standard Recovery Rectifiers 配置: 反向电压:100 V 正向电压下降: 恢复时间:1.2 us 正向连续电流:2 A 最大浪涌电流:35 A 反向电流 IR:5 uA 安装风格:SMD/SMT 封装 / 箱体:DO-221AC 封装:Reel |
| NUP1301U | 制造商:NXP Semiconductors 功能描述:DIODE ESD 0.6PF SOT323 制造商:NXP Semiconductors 功能描述:DIODE, ESD, 0.6PF, SOT323 制造商:NXP Semiconductors 功能描述:DIODE, ESD, 0.6PF, SOT323; Diode Type:ESD Protection; Power Dissipation Pd:200mW; Clamping Voltage Vc Max:20V; Diode Case Style:SOT-323; No. of Pins:3 ;RoHS Compliant: Yes |
| NUP1301U,115 | 功能描述:ESD 抑制器 0.6 pF RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
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