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| 型号： | PCA9685PW/Q900,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 45/51页 |
| 文件大小： | 0K |
| 描述： | IC PWM CTLR LED DVR 28TSSOP |
| 产品培训模块： | I²C Bus Fundamentals |
| 标准包装： | 1 |
| 拓扑： | 开路漏极，PWM |
| 输出数： | 16 |
| 内部驱动器： | 是 |
| 类型 - 主要： | 背光，LED 闪烁器 |
| 类型 - 次要： | RGBA |
| 频率： | 25MHz，50MHz |
| 电源电压： | 2.3 V ~ 5.5 V |
| 输出电压： | 5.5V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 28-TSSOP |
| 包装： | 标准包装 |
| 工作温度： | -40°C ~ 85°C |
| 其它名称： | 568-5931-6 |
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NXP Semiconductors
PCA9685
16-channel, 12-bit PWM Fm+ I 2 C-bus LED controller
16. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
17. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description” .
17.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
17.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
? Through-hole components
? Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
?
?
?
?
?
?
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
17.3 Wave soldering
Key characteristics in wave soldering are:
PCA9685
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 2 September 2010
? NXP B.V. 2010. All rights reserved.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9691BS/1 | 制造商:NXP Semiconductors 功能描述:IC ADC/DAC 8-BIT I2C 16-HVQFN 制造商:NXP Semiconductors 功能描述:IC, ADC/DAC, 8-BIT, I2C, 16-HVQFN |
| PCA9691BS/1,118 | 功能描述:I2C 接口集成电路 ADC/DAC 16-Pin HVQFN EP RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| PCA9691BS/1118 | 制造商:NXP Semiconductors 功能描述:PCA9691BS/HVQFN16/REEL13//1 |
| PCA9691T/1，112 | 制造商:NXP Semiconductors 功能描述: |
| PCA9691T/1，118 | 制造商:NXP Semiconductors 功能描述: |
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