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| 型号： | PCA9685PW/Q900,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 46/51页 |
| 文件大小： | 0K |
| 描述： | IC PWM CTLR LED DVR 28TSSOP |
| 产品培训模块： | I²C Bus Fundamentals |
| 标准包装： | 1 |
| 拓扑： | 开路漏极，PWM |
| 输出数： | 16 |
| 内部驱动器： | 是 |
| 类型 - 主要： | 背光，LED 闪烁器 |
| 类型 - 次要： | RGBA |
| 频率： | 25MHz，50MHz |
| 电源电压： | 2.3 V ~ 5.5 V |
| 输出电压： | 5.5V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 28-TSSOP |
| 包装： | 标准包装 |
| 工作温度： | -40°C ~ 85°C |
| 其它名称： | 568-5931-6 |
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NXP Semiconductors
PCA9685
16-channel, 12-bit PWM Fm+ I 2 C-bus LED controller
? Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
? Solder bath specifications, including temperature and impurities
17.4 Reflow soldering
Key characteristics in reflow soldering are:
? Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 38 ) than a SnPb process, thus
reducing the process window
? Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
? Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 16 and 17
Table 16.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature ( ° C)
Volume (mm 3 )
< 350
≥ 350
< 2.5
≥ 2.5
Table 17.
235
220
Lead-free process (from J-STD-020C)
220
220
Package thickness (mm)
Package reflow temperature ( ° C)
Volume (mm 3 )
< 350
350 to 2000
> 2000
< 1.6
1.6 to 2.5
> 2.5
260
260
250
260
250
245
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 38 .
PCA9685
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 2 September 2010
? NXP B.V. 2010. All rights reserved.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9691BS/1 | 制造商:NXP Semiconductors 功能描述:IC ADC/DAC 8-BIT I2C 16-HVQFN 制造商:NXP Semiconductors 功能描述:IC, ADC/DAC, 8-BIT, I2C, 16-HVQFN |
| PCA9691BS/1,118 | 功能描述:I2C 接口集成电路 ADC/DAC 16-Pin HVQFN EP RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| PCA9691BS/1118 | 制造商:NXP Semiconductors 功能描述:PCA9691BS/HVQFN16/REEL13//1 |
| PCA9691T/1，112 | 制造商:NXP Semiconductors 功能描述: |
| PCA9691T/1，118 | 制造商:NXP Semiconductors 功能描述: |
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